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EMS provider Kimball Electronics in Jasper, Indiana is continually upgrading their manufacturing capabilities. As part of this process; they will be liquidating some of their excess and unused assets utilizing the online auction services of Baja Bid. The bidding for this event will open promptly at 8:00am EST on June 22, 2015 and the closing will begin at 1:00pm EST on June 24, 2015.
The items in this event include a DEK Horizon 01 Screen Printer; Vitronics 6747 Selective Solder; Fuji IP-III and CP-643 SMT Pick & Place Machines; Research International Reflow Oven; Conveyors; Thermotron Ovens; Microscopes; Oscilloscopes; Function Generators; Power Supplies; Current Probes; Data Acquisition & Switching Units; Torque Testers; Accelerometers; and Much More…….
To view the complete line of items currently up for auction; please CLICK HERE.
Any questions about the event can be directed to Arlin Horsley at 1-813-992-2437.
Andy Shaughnessy, I-Connect007
I recently spoke with Rob Boguski, president of Fremont, California-based Datest and an SMTA vice president and board member. Rob explained why today’s test customers are asking for more information than the traditional pass/fail, offers a preview of SMTA International, and gives an update on SMTA’s planning strategy for the next five years.
Dr. Ronald C. Lasky, Indium Corp.
It may be difficult to see any bright spots in the current and recent economic situation. We have all experienced the devastation of the pandemic, supply chain issues, and most recently, inflation. However, as a senior technologist for an international materials supplier (Indium Corporation) and a professor of engineering at an Ivy League research university (Dartmouth College), I offer these four silver linings for those of us in the electronics industry.
Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.