ICD Releases 2015 Version of the ICD Stackup and PDN Planner


Reading time ( words)

In-Circuit Design Pty Ltd (ICD), Australia, developer of the ICD Stackup and PDN Planner software, has released the 2015 version of their popular software.

Impedance plots have been incorporated into this new release. “The impedance plots are simulated by multiple passes of the field solver (in the background) to create heads-up graphs of how to adjust the particular variables to achieve the target impedance.” said Barry Olney, CEO.

Further, with the addition of Panasonic Megtron 7 E-glass and Low Dk-glass (34MHz) the dielectric materials library has been increased to an impressive 16,700 ready-to-use materials up to 100GHz. There are also over 5,250 capacitors, derived from SPICE models, in the PDN library.

The IPC-2581B format, bi-directional interface has now been thoroughly tested by the IPC-2581 Consortium. “This new feature gives the ICD Stackup Planner the ability to import/export Cadence Allegro 16.6 and OrCAD 16.6 stackups and to import Altium Designer and Zuken CR-8000 & CR-5000 stackups” said Olney.

Existing support customers are advised to contact ICD to obtain download instructions for both the new software and the 2015 license server. Owners of a previous version may upgrade at an affordable price.

About In-Circuit Design Pty Ltd

In-Circuit Design Pty Ltd, based in Australia, developed the ICD Stackup and PDN Planner software, is a PCB Design Service Bureau and specialist in board level simulation. For further information or to download a free evaluation of the software, please go to www.icd.com.au   

All trademarks are trademarks of their respective owner. 

Share


Suggested Items

Thermal Management Update with Doug Brooks

01/22/2018 | Andy Shaughnessy, PCBDesign007
I had the opportunity to talk with our contributor Doug Brooks recently. He has been doing some research on temperature effects on PCB traces over the last few years, and I wanted to check the status of his latest thermal efforts. He discussed his work with Dr. Johannes Adam, why temperature charts based on a trace in isolation are inaccurate, and how the industry remained so wrong about PCB temperatures for so long.

Mike Jouppi Discusses his Drive for Better Thermal Data

01/12/2018 | Andy Shaughnessy, PCB Design007
If you mention thermal management in a group of PCB designers and design engineers, Mike Jouppi’s name usually pops up. Mike is an engineer and founder of the Thermal Management LLC consulting firm. He spent years updating IPC’s charts on current-carrying capacity, which had been unchanged since the 1950s. I recently caught up with Mike and asked him to give us his views on the state of thermal management, as well as the tools and standards related to thermal design.

That’s Hot: Ventec’s Goodwin on Thermal Management

01/03/2018 | Patty Goldman, I-Connect007
IPC’s fall committee meetings were held in conjunction with SMTA International, as has been the case for several years now. Patty Goldman sat in on some subcommittee meetings, including one on laminates, where she met up with Ventec COO Mark Goodwin for a discussion on thermal management from a laminate supplier’s perspective.



Copyright © 2018 I-Connect007. All rights reserved.