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This free seminar will discuss the new features included in Keysight’s EEsof EDA simulation tools and how the software helps engineers focused on high-speed digital electronics solve their toughest design challenges. The seminar will look at all stages of the pre-layout, post-layout and measurement design flow.
Tools featured in the seminar include: ADS, ADS Controlled Impedance Line Designer (CILD), SI S-parameter analysis tools, and the ADS PCIe and USB test benches used with Keysight real-time oscilloscope certified test compliance software.
Attendees also will see a preview of the new power integrity PI Pro simulator with IR drop and decoupling capacitor optimization, available in upcoming release of ADS 2015.09. Registration is required to attend.
July 14 and July 16
Agilent Technologies, 5301 Stevens Creek Boulevard, Santa Clara, CA, the Aristotle Room.
To register, click here. For additional information, visit www.keysight.com/find/eesof.
Andy Shaughnessy, I-Connect007
For our multi-board design issue, I interviewed Dave Wiens, product marketing manager for Mentor, a Siemens business. We discussed how the multi-board design technique differs from laying out single boards, along with the planning, simulation and analysis processes required to design multi-board systems.
Chang Fei Yee, Keysight Technologies
This article briefly introduces the 4-level pulse amplitude modulation (PAM-4) and its application in 400 Gigabit Ethernet (400GbE), to support the booming data traffic volume in conjunction with the deployment of 5G mobile communications. Furthermore, this article also highlights the essential pre-layout effort from signal integrity perspective for physical (PHY) link design on a PCB, including material selection, transmission line design and channel simulation to support 56Gbps data rate that paves the way for seamless communication in 400GbE.
Dave Lackey and Anaya Vardya, American Standard Circuits
The design process is arguably the most important part of the flex circuit procurement process. The decisions made in the design process will have a lasting impact, for better or worse, throughout the manufacturing cycle. In advance of providing important details about the actual construction of the flex circuit, it is of value to provide some sort of understanding of the expected use environment for the finished product.