Setting the Standard for PCB Design Tool Solutions


Reading time ( words)

No matter if you are part of a small team focusing on just one aspect of the PCB design flow or you are “THAT designer” who can do it all – PADS has the right solution at the right price for you!

At $5000USD Including Support: PADS Standard delivers a full-flow solution for PCB development, including schematic, component management, layout, routing, and manufacturing prep. Easy-to-use schematic and layout translators help import libraries and designs from your current toolset, whether it’s Allegro®, Altium® Designer, CADSTAR®, OrCAD®, P-CAD®, or Protel®.

But if you are “THAT designer” who requires a design flow with integrated advanced board-level analog simulation analysis and verification capabilities, PADS Standard Plus is equipped with all the analysis and verification functionality you need to produce quality PCBs faster.

PADS-3-520x522.png

PADS Standard Plus includes all the features of PADS Standard plus signal integrity analysis powered by HyperLynx® technology enabling you to determine routing constraints and verify your routed PCB as well as identify and address potential “hot spots” through thermal analysis that takes into account conduction, convection, and radiation cooling effects.

What? – You’re “THAT designer” that does even EVEN MORE?

Then PADS Standard Plus can deliver EVEN MORE capabilities by offering tools for DFT, DFMA, MCAD Collaboration and even Advanced Packaging if desired.

But lets say you’re “THE designer” –  The one that HAS TO DO IT ALL? – And on the most complex PCB Designs.

If you need a tool with all the horsepower and features of an Enterprise solution that fits all your design needs and your budget – look no further than PADS Professional! PADS Professional utilizes Xpedition® technology that handles the most demanding and complex designs, where other solutions fail. Get all the features and functionality of PADS Standard Plus including high-speed routing and access to the most advanced features like advanced FPGA synthesis, FPGA I/O optimization, unified constraint management, electrical sign-off based on full board DRC screening and signal/power integrity analysis, just for starters. Add to that a best-in-class layout PCB environment featuring concurrent 2D and 3D physical design and a correct-by-construction approach to placement, plane design and routing.

PADS Professional also delivers the industry’s most powerful interactive routing environment for large busses, single ended and differential pair nets AND includes our new ground-breaking sketch routing technology! Whats that?, you need even more advanced fabrication design features including HDI, RF, flex circuitry and embedded components?  – Done!  Check out PADS Professional today!

See how PADS has set the standard in PCB design solutions for yourself!  Click here and compare these 3 PADS solutions today!

Share

Print


Suggested Items

A Library Management Cautionary Tale

02/12/2021 | Steven V. Chavez, CID+
The library management of footprints, land patterns, or cells—however you refer to them in your ecosystem—is one of the most critical items in the foundation of any PCB or CCA design. When I was asked to write an article on this topic, so many thoughts and experiences instantly flooded my mind. After 30+ years of designing PCBs throughout the industry, I have my share of experiences and stories about footprints. One particular experience stands out.

Wild River ISI-56 Platform Accelerates SerDes Testing

02/02/2021 | Andy Shaughnessy, Design007 Magazine
I recently spoke with Al Neves, founder and CTO of Wild River Technology, about the release of their new ISI-56 loss modeling platform. Al explains why it was so critical that this tool meets the stringent requirements of the IEEE P370 specification (which he helped develop), and why he believes this is currently the best tool for SerDes testing and characterization.

Seven Tips for Your Next Stackup Design

02/01/2021 | Eric Bogatin, University of Colorado, Boulder
Rarely do we have the luxury of designing a board just for connectivity. When interconnects are not transparent, we must engineer them to reduce the noise they can generate. This is where design for signal integrity, power integrity and EMC—collectively high-speed digital engineering—are so important. Eric Bogatin offers seven tips for stackup design.



Copyright © 2021 I-Connect007. All rights reserved.