Mentor Graphics White Paper: 10 Key Challenges In Electronics Thermal Design


Reading time ( words)

Miniaturization of electronics is continuing to increase power densities at all packaging levels. Miniaturization arises from cost reduction, being the key driver in many industry sectors, resulting in increasingly tighter design margins and less tolerance of over-design. This is particularly true in the physical design of the product, where over-design results in additional weight, volume, and in some cases manufacturing and assembly costs, increasing the cost of the final product.

Removing heat is critical to the operation and long-term reliability of electronics. Component temperatures within specification are the universal criteria used to determine the acceptability of a design. Cooling solutions directly add weight, volume, and cost to the product, without delivering any functional benefit. What they provide is reliability. Without cooling, most electronics products would fail in a matter of minutes. Leakage current and thus leakage power goes up with smaller die-level feature sizes, and because leakage is temperature-dependent, thermal design is more important, as is the need to preserve power for Internet-of-Things (IoT) connected devices.

How, then, should engineering managers in organizations engaged in developing products that include complex and/or high-power electronics ensure the thermal performance of their products while meeting other design criteria?

To answer this question, we explore the following 10 key challenges in electronics thermal design.

Click here to download the white paper.

Share


Suggested Items

Excerpt: The Printed Circuit Designer’s Guide to…Flex and Rigid-Flex Fundamentals

06/20/2018 | Dave Lackey and Anaya Vardya, American Standard Circuits
The design process is arguably the most important part of the flex circuit procurement process. The decisions made in the design process will have a lasting impact, for better or worse, throughout the manufacturing cycle. In advance of providing important details about the actual construction of the flex circuit, it is of value to provide some sort of understanding of the expected use environment for the finished product.

Faster Board Speeds Demand Constraint-Driven Design

06/19/2018 | Ralf Bruening, Zuken
Using powerful constraint techniques can be a double-edged sword. While the design process is made much safer by including constraints, it is all too easy to over-constrain the design and make it impossible to complete routing and placement. Even paper design guidelines can make products uneconomic to produce unless a great deal of engineering knowledge is applied during the design.

Making the Most of PCB Materials for 5G Microwave and mmWave Amps

06/13/2018 | John Coonrod, Rogers Corporation
Ready or not, 5G is coming, and it will require the right circuit materials for many different types of high-frequency circuits, including power amplifiers. 5G represents the latest and greatest in wireless technology, and it will be challenging to design and fabricate, starting with the circuit board materials, because it will operate across many different frequencies, such as 6 GHz and below, as well as at millimeter-wave frequencies (typically 30 GHz and above).



Copyright © 2018 I-Connect007. All rights reserved.