IPC Extends Deadline for Submission of Technical Paper Abstracts


Reading time ( words)

IPC has extended the deadline for the submission of abstracts for technical papers to be presented at the IPC APEX EXPO 2016 technical conference.

Authors who would like to present at the conference next year should send in a 300-word abstract summarizing technical work and covering case histories, research and discoveries. It must be received by September 14, 2015. Authors of papers selected for the conference will each receive a detailed speaker manual to assist them with numerous items, including the formatting of their papers and presentation slides.

The selection process is competitive and sufficient detail needs to be included to allow the Technical Program Committee to properly assess content of the proposed paper. If abstract is selected, the paper will be due December 11, 2015 and presentation slides will be due on December 18, 2015. The paper should be non-commercial and describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results.

Submissions are sought on design, materials, assembly, processes and equipment in areas from adhesives and advanced technology to underfills and via plugging.

For more information, click here.

Share




Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/20/2022 | Andy Shaughnessy, I-Connect007
This week, we bring you an article about manufacturing training for veterans, and a review of a great signal integrity webinar. IPC honors its A-Teams with the coveted Golden Gnome Awards, and Technica discusses various ways for fabricators to increase ROI. Dan Beaulieu has a review of a really cool book: Back to Human—How Great Leaders Create Connection in the Age of Isolation. In spite of all the meetings on Teams and Zoom, it’s easy to feel disconnected. But great leaders find a way to foster that connectivity.

PCB Technologies’ InPack to Focus on Miniaturization, Packaging

05/16/2022 | Andy Shaughnessy, Design007 Magazine
I recently spoke with PCB Technologies’ Jeff De Serrano, Yaniv Maydar, and Alon Menache about their new venture, InPack. They explain their plans to focus on advanced packaging, miniaturization, and other high-end technology, with much faster time to market, and they offer a view of the global market as well.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/13/2022 | Nolan Johnson, I-Connect007
The big news in the industry this week was the new bill introduced to the U.S. Congress in support of the PCB manufacturing industry. The Supporting American Printed Circuit Boards Act of 2022, which was introduced by Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT), incentivizes “purchases of domestically produced PCBs as well as industry investments in factories, equipment, workforce training, and research and development.” The bill is a PCB-oriented complement to the semiconductor-oriented CHIPS Act of 2021.



Copyright © 2022 I-Connect007. All rights reserved.