T-Tech Releases IsoPro 3.2


Reading time ( words)

T-Tech, the manufacturer of the Quick Circuit line of rapid prototyping systems, has released IsoPro 3.2 software. This is the first major software release this year.

From user feedback our customers asked for an Isolation program which could produce Isolation data in G-Code format. IsoPro 3.2 provides these services allowing a company the opportunity to manufacture printed circuit boards on the Quick Circuit, in house, within an hour from the time the schematic and layout are completed.

The Contact-by-Touch software feature for the Quick Circuit QCJ5 is new and improved. You can now calibrate the depth of cut with the tool touching off the surface of the material in an average of five seconds from the time the tool has changed. This kind of precision calibration has never been achievable on a rapid prototyping machine before.

The real-time milling progress within IsoPro 3.2 is greatly enhanced. This allows the operator to automatically align multilayer PCBs in their lab. From over 10,000 customer installations in over 78 countries, scientists, electrical engineers and technicians now have an improved capability to produce prototype circuit boards in an environmentally friendly fashion.

For more information about IsoPro 3.2, contact sales@t-tech.com or call 800-370-1530.

You can also learn more about IsoPro 3.2 at PCB West in the Santa Clara Convention Center in Santa Clara, California. T-Tech is located in booth #500.

Share


Suggested Items

Chuck Bauer Discusses the Future of Packaging

09/05/2018 | I-Connect007 Editorial Team
When we decided to cover the future of PCB packaging, we knew we would have to interview Charles Bauer, Ph.D., owner of TechLead Corporation. Chuck recently spoke with Happy Holden, Andy Shaughnessy and Barry Matties about current trends in packaging, the need for product designers and manufacturers to communicate, and why no matter how cool the technology is, cost is still king.

BGA Fanout Routing Overview

09/04/2018 | Christian Keller, Altium
PCB developers are deluged with new challenges caused by increasing density and smaller components. Ball grid arrays (BGAs) create particular challenges during layout, with hundreds of connections in just a few square centimeters. Fortunately, designers now have options for addressing these issues.

Excerpt: The Printed Circuit Designer’s Guide to…Flex and Rigid-Flex Fundamentals

06/25/2018 | Dave Lackey and Anaya Vardya, American Standard Circuits
The design process is arguably the most important part of the flex circuit procurement process. The decisions made in the design process will have a lasting impact, for better or worse, throughout the manufacturing cycle. In advance of providing important details about the actual construction of the flex circuit, it is of value to provide some sort of understanding of the expected use environment for the finished product.




Copyright © 2018 I-Connect007. All rights reserved.