SMTA Seeks Papers for 2016 Events

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SMTA announced that abstracts are now being accepted for several events taking place in 2016.  All submissions must be non-commercial in nature and focus on technology research rather than a company product. The following events are all currently soliciting abstracts:

South East Asia Technical Training Conference on Electronics Assembly Technologies

Abstracts Deadline: January 4th, 2016

International Conference on Soldering and Reliability (ICSR)

Abstract Deadline: January 15, 2016

SMTA International Conference

Abstract Deadline: February 12, 2016

International Wafer-Level Packaging Conference (IWLPC)        

Abstract Deadline: April 16, 2016

On-line Presentations (Webinars & Webtorials)

Now scheduling for 2016 - Contact Jenny,

Journal of SMT

Now accepting papers for 2016 publication - Contact Ryan,

Submission of an abstract for an SMTA program is with the understanding that, if accepted, the author will provide a conference presentation and/or a technical paper for the proceedings.

View details online:  Please contact Jenny Ng, or 952-920-7682, with questions.

About SMTA

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.



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