Reading time ( words)
- Ucamco's UcamX goes Academic
- Seica SpA announces that the company has been selected by Hella KGaA Hueck & Co as worldwide new electronic board ICT tester supplier.
- Polar Speedstack 2016 significantly enhances layer and impedance structure editing
- ICT Darlington Seminar
- Graphic Plc wins BAE Systems Gold Award
- Acquisition writ large
- Enthone Introduces ZINCROLYTE Sprint High Throughput, Alkaline Zinc-Nickel Process
- Help IPC Persuade U.S. Congress to Extend the R&D Tax Credit
- A defect-free, molecule-thick film
- Graphene production breakthrough
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
01/08/2021 |
Nolan Johnson, I-Connect007
It’s a new year, and time for new resolutions and new beginnings. “New year, new you” certainly is reflected in this past week’s news. We saw several announcements regarding mergers, acquisitions, and organizational changes, plus some government legislation to help kick off the new year. Based on viewing activity, readers were keen to keep up on the changes under way.
IPC CEO and President John Mitchell Discusses New Membership and Dues Structure
01/07/2021 |
I-Connect007 Editorial Team
In this video, IPC CEO and President Dr. John Mitchell discusses the organization’s move from a site-based and enterprise membership dues structure to a company revenue-based model. Mitchell explains that this change will go into effect upon each member company’s renewal in 2021, and he points out that many of the existing member discounts will remain unchanged.
Whiteside’s View From the Summit: An Industry Perspective
01/04/2021 |
Nolan Johnson, I-Connect007
I spoke with Shane Whiteside to get his unique perspective on the industry as president and CEO of Summit Interconnect, as well as his position on the board of directors for the IPC. Whiteside discusses the business challenges he sees overall.
