AIM Solder Talks Innovations to Address Assembly, Reliability Issues


Reading time ( words)

David Suraski, executive vice president at AIM Solder's assembly materials division, sat down with us at productronica 2015 to discuss the latest industry trends and customer challenges facing the solder industry, and innovations that are helping customers address their issues. Suraski also talked about reliability issues, and how the company is addressing them.

Barry Matties: David, please start with a little bit about AIM Solder.

David Suraski: AIM Solder is a leading global supplier of materials to the electronics industry, specifically solder materials. Within solder materials, the product line consists of solder paste, liquid flux, bar solder, and wire solder. We also sell some epoxies, under fills, cleaners, and pre-forms.

I help to lead AIM’s electronics assembly division. We define electronics assembly as anyone who is assembling a circuit board. Basically, our materials are what enables the components to adhere to a circuit board.

We're a global manufacturer. Our headquarters are in Montreal, Canada. We have facilities in the United States, Mexico, China, Hong Kong, and Poland, and we have technical support personnel and other sales offices throughout the world, including India, Philippines, Singapore, and Brazil.

Matties: How many employees are in your organization?

Suraski: About three hundred in the manufacturing division.

Matties: With regard to your customers, what sort of demands do they come to you with?

Suraski: More and more, they're increasingly relying on their suppliers. First of all, there are product demands. Obviously, in electronics, everyone has always been talking about things getting faster and things getting smaller. That puts a lot of burden and requirements on the materials themselves. A solder paste that used to print a certain pitch several years ago could not be used for the very-fine pitch devices now. There are many requirements on the materials, from everything from wetting to reliability and everything in between, and that requires constant innovation.

We have a very aggressive R&D program. Once the right products are in place, we offer a great deal of support as well. We have more technical support personnel than we do salespeople. We find that's a key to not only winning, but maintaining business. Our support people work with our customers on a regular basis to ensure that they can use the product properly, that they improve their throughput, that they solve any issues that they may be having, even if they're unrelated to our products, and they have the capability to embrace new technologies. For example, going from 0402 to 0201s to 01005s. We want to fix problems before they happen.

Matties: I'm glad you brought up problems. We recently conducted a survey about failures, and the largest area of failure tends to be with solder joints.

Suraski: Yeah, the solder guys always get blamed for it.

Matties: Maybe you're not blamed for it, but it's your product that they're having a difficult time getting 100% quality from.

Suraski: Right, that's true, and the solder joint is critical, of course. Issues with solder joints can be because of the process, the circuit board, or the component, and of course it can be caused by the solder itself. Our job is to become experts in all of those areas. To be able to, first of all, analyze what's going on if there is an issue, and then come up with good practical solutions to our customers.

Matties: If a manufacturer wants to ensure quality, the only way to really do it is through inspection. It doesn’t matter how robust their processes are, because there are so many variables; the defects can happen at any time for any reason, so you have to inspect. Is the goal to get rid of solder? How do we mitigate the amount of failures?

Suraski: People have been talking about alternatives. We're decades away from having everything completely embedded, for example, so there has to be some joining process. Solder remains the best way to join, because of its thermal and electrical characteristics and because it can self-correct component placement errors. It can also be reworked; you can solder and then if necessary you can de-solder without damaging the assembly. This is different than, say, a conductive adhesive, which is very difficult to take apart once it's put together. As long as joining needs to be done, there is going to be soldering. If you get the right products and processes in place, you can have a very repeatable, robust process.

Inspection is going to be important, and there are different types of inspection, but if you're attentive a couple of steps before that, and doing it right, and getting the right support from suppliers, then you can avoid most of those issues.

Matties: What is the advice you would give a fabricator or an assembler?

Suraski: That would be to focus on the process. Get the right products in place. Some perform 100% inspection, some do zero inspection. It really varies depending on their needs, requirements, or whatever they happen to be building. Incoming inspection is very important, as well, to make sure the components you're using are right for the process. We see that a lot of issues are related to the components.

Matties: It's about all the steps prior to where the solder meets the board or the joint.

Suraski: If you have a bad component, no matter how good your solder is, it's not going to work. If you have good parts going on, solid repeatable processes, then you can have a robust process, no matter how complicated it is.

Stephen Las Marias: You mentioned about the quality of the products and the parts coming in. What about if the applications are in really harsh environments, for instance, in aerospace or automotive?

Suraski: That often comes down to the alloy and the flux residue. We work with several automotive manufacturers, for example, and part of it comes down to design. You need the geometry of the solder joint itself to be correct for the application.

Some alloys are better in certain conditions. There are different lead-free alloys, and some are very good for vibration. Some are very good for thermal shock, so it's choosing the correct alloy for that particular application. It's a matter of the supplier working with the manufacturer, in most cases.

Another contributing factor to reliability is the flux residue itself. It’s really our job to develop flux residues that are inert, and be confident we are not going to harm the product after it's produced, no matter what kind of condition it's in.

Share


Suggested Items

Strategies for Choosing Solder Paste for Successful Electronics Assembly

08/10/2018 | Jason Fullerton, Alpha Assembly Solutions
One common question from solder customers is, "How do I test and evaluate new solder pastes?" Although that seems like it should be a straightforward question with an easy answer, this could not be further from the truth. This article tells more about this, and how to best select solder pastes for your product.

Evaluating the Impact of Powder Size and Stencils on Solder Paste Transfer Efficiency

07/31/2018 | T. O’Neill, C. Tafoya, and G. Ramirez, AIM Metals and Alloys
Building upon an earlier study that focused on solder paste powder size, room-temperature aging and PCB pad and aperture designs, this study continues to investigate powder mesh size, but also examines stencil surface treatments and stencil foil tension.

Flex Circuit Assembly: Challenges and Strategies for Success

07/27/2018 | Stephen Las Marias, I-Connect007
The flexible printed circuit market is on track for growth. But dealing with flex circuits during assembly is very different from rigid PCBs. This article highlights some of the assembly challenges when working with flex circuits, and strategies to address them.



Copyright © 2018 I-Connect007. All rights reserved.