IPC Standards Committee Reports – Packaged Electronic Components, Flex Circuits, High Speed/High Frequency, Rigid Printed Boards


Reading time ( words)

Packaged Electronic Components

The B-11 3-D Electronic Packages Subcommittee continued work on IPC-7091, Design and Assembly Process Implementation of 3-D Components. There has been significant interest in this standard from both the military and commercial markets, and the subcommittee is ensuring groups doing similar work are included in the efforts for IPC-7091.

Flexible Circuits

The D-11 Flexible Circuits Design Subcommittee met to advance the Working Draft to IPC-2223D, Sectional Design Standard for Flexible Printed Boards. The group reviewed and approved new drawings depicting flexible cross-sectional construction examples and unbonded flex cross-sectional constructions for rigid-flex designs.  The group also reviewed new content addressing the factors that affect impedance and capacitance control for flex and rigid-flex printed board applications so as to mitigate signal integrity issues.

The D-12 Flexible Circuits Performance Subcommittee met to advance the Working Draft to IPC-6013D, Qualification and Performance Specification for Flexible Printed Boards. The group also reviewed a cross-sectional illustrations that address voiding or delamination in the transition zone between flexible material and rigid material. The group also reviewed examples of anomalies in flexible printed board assemblies (e.g. kinks in the ribbon cable following assembly operations) and agreed to submit recommendations to the IPC 7-31b task group for addressing these issues in a future revision to IPC-A-610, Acceptability of Electronic Assemblies.

The D-13 Flexible Circuits Base Materials Subcommittee began review and updating of IPC-4202A to ultimately revise it to B revision.

The D-15 Flexible Circuits Test Methods Subcommittee began to review all flexible circuits test methods for relevance to all materials, printed boards and design standards.   Most if not all test methods that apply to old flexible circuits (those that begin with “FC” are likely to be obsolete and will likely be archived.

Share


Suggested Items

From Math to Marketing: Orbotech CMO’s Worldview of the Industry

04/09/2018 | Barry Matties, I-Connect007
Barry Matties met with Orbotech’s corporate VP of Business Development and CMO, Lior Maayan, in Shenzhen and spoke about the next-generation processes currently challenging Orbotech's R&D team. Most notable among them are additive technologies like the automated optical shaping solution, and the growth of MSAP, flex, and HDI.

Equipment/Process Selection: Case Study of a DMADV Approach to PCB FAB Process Design

02/05/2018 | Alex Stepinski, WHELEN ENGINEERING
This article outlines the approach we took to designing this new phase of our commercial existence, which has now been spun off as a separate business unit known as Greensource Fabrication. This new business unit is expected to go live in 2018.

HDI: Today, Tomorrow and the Future

12/05/2017 | I-Connect007
For the November issue of The PCB Magazine, our editorial team interviewed some of the top HDI experts in the PCB supply chain. Joining us on the conference call were Steve Bird, PCB/flex technology manager at Finisar, and Tony Torres of APCT.



Copyright © 2018 I-Connect007. All rights reserved.