The December 2015 Issue of The PCB Design Magazine: Inside the Designers Council

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The December issue of The PCB Design Magazine takes a look at an organization that's been serving PCB designers for nearly 25 years: the IPC Designers Council. Though it's managed by IPC, local Designers Council chapters are largely autonomous, and lead by often-unappreciated volunteers. We talked to a variety of movers and shakers in the DC to get a handle on where the group has been, and where it's headed.

To read the new issue, click here.  

10/09/2020 | Andy Shaughnessy, Design007 Magazine

It’s showtime! This past week, we saw quite a bit of news about virtual trade shows. It’s great to see show managers pivot from live, in-person events to virtual shows with only a few months to make it all happen. How would you like to be a show manager today?

10/07/2020 | I-Connect007 Editorial Team

Johannes Adam is the creator of a simulation tool called Thermal Risk Management (TRM) used to help PCB designers and design engineers predict hot spots on the board before during layout. He and Douglas Brooks, founder of UltraCAD Design, have used the tool to produce several technical articles and a book on the subject. In this interview, they tackle the biggest misconceptions they see from designers and engineers who deal with thermal management issues.

10/01/2020 | Douglas G. Brooks, PhD

Many design engineers and even many software suppliers make the significant mistake of equating changes in trace or via temperature with current density. This is incorrect at best and dangerous at worst. There is little if any correlation between temperature and current density. Current and trace dimensions (among other things) are the relevant variables, but current density is not. I hope by the end of this article you will see why. Here are four illustrations that will help you understand this.