Frontline Releases InCAM 2.32


Reading time ( words)

Released on January 10, 2016, InCAM 2.32 is a minor new version that introduces numerous workflow throughput enhancements, including the ability to run Step Compare in the background and to add multiple dimensions simultaneously. In addition, two new DFM functions improve the production process for HDI and IC-packaging boards.

New Features

Reduce the galvanic effect during the gold plating process
Run the new Non-Tieline Gold Galvanic Compensation DFM to calculate the gold/copper or copper/gold ratio that is below a defined threshold and take steps to reduce the galvanic effect during gold plating.

Apply etch compensation to the narrow parts of a surface
Use the new Patch Bottlenecks DFM to automatically detect locations where surface width is below the defined value and apply a patch to these locations, enabling the application of etch compensation to the narrow parts of a surface.

Quickly create dimensioned drawing with multiple dimensions
Create dimensioned drawings faster – (co)ordinate, linear or baseline dimensions – by adding multiple dimensions at the same time.

Get Step Compare results per layer as soon as they’re ready
Run Step Compare in the background while getting on with other tasks. Step Compare can run in parallel on different layers, delivering results one by one as they become ready, while the remaining layers continue processing.

Improved sub-assembly electrical testing
Optimize netlists and create an electrical testing program for sub-assembly testing.

Share

Print


Suggested Items

Communication, Part 5: Internet Impedance Calculators for Modeling

11/05/2019 | Steve Williams, The Right Approach Consulting LLC
Bob Chandler of CA Design and Mark Thompson of Prototron Circuits address how new engineers use internet impedance calculators for modeling (e.g., formulas versus recipes) in Part 5 of this series. Do you use impedance calculators that you found on the internet? Read on!

Bob Martin Brings Maker Attitude to AltiumLive Keynote

10/07/2019 | Andy Shaughnessy, Design007 Magazine
Bob Martin is a self-proclaimed “Wizard of Make” and senior staff engineer with Microchip Technology. Next week, this leader of the maker community will be one of the keynote speakers at AltiumLive in San Diego, California. I caught up with Bob and asked him to give us a preview of his presentation.

Development of Flexible Hybrid Electronics

08/14/2019 | Weifeng Liu, PhD, Flex
This article will present a hybrid manufacturing process to manufacture FHE systems with a two-layer interconnect structure utilizing screen printing of silver conductive ink, filled microvias to connect ink traces at the different layers, and use of the traditional reflow process to attach the semiconductor chips to the printed substrates.



Copyright © 2019 I-Connect007. All rights reserved.