Cirexx Develops ECLIPS Demonstration Module


Reading time ( words)

Cirexx International announced today that they have developed a module to demonstrate their ECLIPS technology. ECLIPS (Embedded Cooling Layer – Integrated Power System) is a system of producing high-power RF/microwave Printed Circuit Boards (PCBs) employing an embedded thermally engineered metalized heat-sink layer which has superior thermal conductivity characteristics and a very low-CTE.

The Cirexx ECLIPS technology serves as an alternative to co-fired ceramics and hybrid integrated circuits. The item is essentially a common Printed Circuit Board, made from otherwise typical RF/microwave Printed Circuit Board materials and processes. But with a high thermal conductivity and very low CTE the user can mount very fine pitch devices and in fact direct attach/wire-bond bare die such as GaN and GaAs. The other electronic components on the board can be standard “plastic parts” attached in a standard process such as a vapor phase soldering. This combination results in an electronic board system that is smaller, lighter weight, easier to make revisions to and certainly much less costly than the ceramic hybrid, all-die alternative.

The demonstration module allows Cirexx Application Engineers to demonstrate the technology at customer facilities and/or during ECLIPS presentations. With the use of common lab equipment the module demonstrates the efficient evacuation of heat generated by 2 bare die amplifiers and its effect on the power output. Cirexx President and CEO Philipp Menges said, “This Demo Module is another tool available to help our customers understand and evaluate the ECLIPS technology.”

About Cirexx International

Founded in 1980, Cirexx International, Inc. is an electronic solutions company offering PCB Design, PCB Fabrication and PCB Assembly of high-reliability Printed Circuit Boards, RF/Microwave Circuit Boards, Flexible Printed Circuits and Rigid-Flex Circuit Boards. Recognized as a time-technology leader, the company offers a genuine Quick Turn service and provides a one stop shop and all in-house solution known as Seamless Integration. Cirexx has expertise fabricating high layer count Printed Circuit Boards using a variety of substrates including a wide array of high-frequency RF-based materials in mixed (hybrid) constructions. Cirexx delivers unsurpassed quality and support to a large array of customers in the high-reliability markets of defense/aerospace, industrial, and medical instrumentation.

Share




Suggested Items

Understanding the UHDI Market

11/28/2022 | I-Connect007 Editorial Team
The more we investigate UHDI in the current market, the more advanced packaging becomes a part of the conversation. Yet there are so many questions to be answered. The I-Connect007 Editorial Team met with Calumet’s Todd Brassard and Meredith LaBeau recently to get answers to these questions and find out where the UHDI market is headed.

Taiyo’s Brian Wojtkiewicz Discusses Flex, HDI and More

10/25/2022 | Nolan Johnson, I-Connect007
Nolan Johnson spoke with Brian Wojtkiewicz at PCB West about Taiyo’s latest developments in solder mask technology. They discussed the company’s advances in flexible circuits, HDI, and much more. In particular, Brian discusses the importance of reliability in fabrication and assembly. "We’re always in the fabricators’ shops. I’m out in the field talking to them, helping the operators understand the process, and making things work better because then we don’t have issues down the road," he says.

Catching Up With John Johnson, New Director of Business Development at ASC

09/28/2022 | Dan Beaulieu, D.B. Management Group
It’s always good to catch up with old friends, especially when you can start working together. I recently spoke with my friend John Johnson, who has joined American Standard Circuits as the director of business development. At ASC, John will be using the Averatek A-SAP process that he was previously involved with. He shares some of his background and provides insight on the best ways to use this semi-additive PCB fabrication process that opens the capability window for forming trace and space.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.