ACE to Exhibit New Innovative Soldering Technologies at IPC APEX EXPO 2016


Reading time ( words)

ACE Production Technologies Inc., a supplier of selective soldering systems, lead tinning systems and lead tinning services, will exhibit new innovative soldering technologies in Booth 2022 at the IPC APEX Expo, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center in Las Vegas, Nevada.

A complete range of standalone selective soldering systems including the popular KISS-102 and in-line systems such as the KISS-101IL, KISS-103IL and dual pot KISS-103ILDP will be on display. All systems are equipped with graphics-based software and include automatic fiducial correction and board warp compensation as standard features at no additional cost.

Premiering at APEX, is the LTS300-JEDEC which is the most technologically advanced molten solder lead tinning system on the market consisting of two dynamic nitrogen inerted solder pots, a dynamic flat wave fluxing station, forced convection preheating, aqueous wash and drying stations, plus a JEDEC tray stacker forming a complete component re-tinning work cell.

At the heart of the new LTS300-JEDEC is a fully integrated vision system consisting of top and bottom viewing cameras for accurate alignment of electronic components prior to re-tinning to ensure complete control over fine-pitch components during immersion and extraction of the hot solder dip process. The vision system also performs post-tinning inspection to detect potential solder bridges before placing components back into a JEDEC tray. The LTS300-JEDEC is a fully-configured system capable of performing a molten solder component lead tinning process for gold removal and re-tinning of components for Class 2 and Class 3 applications in compliance with the new J-STD-001, Rev F requirements.

Also on display will be the revolutionary STS-202 dip and look solderability test system. The new ACE solderability tester is capable of performing solderability testing to determine the solderability of component leads and terminations prior to being joined in a soldering operation. The system utilizes the proven dip and look test method in conformance with all IPC, ANSI and MIL standards including J-STD-002, MIL-STD-883 Method 2003 and MIL-STD-202 Method 208.

Share

Print


Suggested Items

Juan Arango on Koh Young’s New U.S. Headquarters

10/27/2019 | Andy Shaughnessy, I-Connect007
At a recent open house, Managing Director Juan Arango talks about his role in the company’s transition from their Arizona facility to a new headquarters located outside of Atlanta, Georgia. Juan details many of the benefits customers can expect, including brand new spaces dedicated to customer demos as well as training.

SMTAI 2019: Chris Bastecki on Low-temperature Solder Challenges and Products

10/14/2019 | Real Time with...SMTAI
Chris Bastecki, director of global PCB assembly at Indium Corporation, discussed challenges of low-temperature solder and the company's new product, Durafuse LT, which provides novel properties and reliability.

Real Time with... SMTAI 2019 Video Interviews

10/09/2019 | Real Time with...SMTAI
The SMTA International Conference and Exhibition 2019, which took place September 22–26, 2019, at the Donald E. Stephens Convention Center in Rosemont, Illinois, concluded successfully. For those of you who were not able to make it to the show, catch our video interviews with the movers and shakers of the electronics industry. We've updated our video presentation for a better experience for our users, so check it out!



Copyright © 2019 I-Connect007. All rights reserved.