IPC APEX EXPO: Glenn Oliver on His IPC 'Best Paper' on High-Frequency Materials


Reading time ( words)

Glenn Oliver of DuPont discusses his award-winning paper, “Round Robin of High-Frequency Test Methods by IPC-D24C Task Group." Co-authors include Jonathan Weldon of DuPont, John Andresakis of Park Electrochemical, Chudy Nwachukwu of Isola, John Coonrod of Rogers Corporation, David L. Wynants of Taconic Advanced Dielectric Division, and Don DeGroot of Connected Community Networks, Inc. The paper looks at high-frequency offerings from a variety of materials providers. 

To watch this video, click here.

Share


Suggested Items

Part 2: EIPC’s 2018 Winter Conference in Lyon, Review of Day 1

02/19/2018 | Pete Starkey, I-Connect007
We continue with the rest of Pete Starkey’s report on Day 1 of the EIPC Winter Conference in Lyon, France. Included in this segment are presentations by Ventec, Ericsson, TTM and others, plus photos of their evening tour of Alstom.

Who Really Owns the PCB Layout? Part 2

02/07/2018 | Paul Taubman, Nine Dot Connects
In Part 1 of this series, Paul Taubman made the bold statement that the PCB layout is just as much a mechanical effort as it is an electrical one. In Part 2, he threads the needle, explaining why he believes that a PCB truly a mechatronic design, and why mechanical engineers may be more prepared to take on the PCB layout.

Thermal Management Update with Doug Brooks

01/22/2018 | Andy Shaughnessy, PCBDesign007
I had the opportunity to talk with our contributor Doug Brooks recently. He has been doing some research on temperature effects on PCB traces over the last few years, and I wanted to check the status of his latest thermal efforts. He discussed his work with Dr. Johannes Adam, why temperature charts based on a trace in isolation are inaccurate, and how the industry remained so wrong about PCB temperatures for so long.



Copyright © 2018 I-Connect007. All rights reserved.