# Mentor Paper: Take Command of Thermal Optimization During PCB Design

Computational fluid dynamics software tools can be useful in considering the effect on a printed circuit board of such things as package selection, board layout and structure as well as enclosure design.

This Mentor Graphics white paper explains:

• Approaches to PCB thermal management studies with CFD
• Automating PCB thermal design modifications using Design of Experiments
• Utilizing parametric studies to explore a range of operating scenarios early in the design process
• Example: Heatsink optimization for cPCI card for cost-effective design
• Tradeoffs: Heat sink geometry & mass vs component allowable temperature ranges and layout

## Electronics vs. Physics: Why Vias Don’t Get Hot

Most of are aware that when we pass an electrical current through a trace (conductor), the trace will heat up. This temperature increase is caused by the I2R power loss dissipated in the resistance of the trace. The resistance of a copper trace is mostly determined by its geometry (cross-sectional area), and there are lots of studies trying to look at the relationship between the current down a trace (of known size) and the resulting temperature of the trace. But the situation is much more complicated than this. There are physical properties that exist that result in helping to cool the trace. These properties are usually a combination of conduction of the heat away from the trace through the material, convection of the heat away from the trace through the air, and radiation of the heat away from the trace.

## Ventec Thermal Management Book Excerpt: Chapter 1

09/05/2022 | Didier Mauve and Robert Art, Ventec
Regarding basic principles of thermal dissipation there are three ways of dissipating energy: Conduction, convection, and radiation. The integrated metal substrate (IMS) printed circuit boards rely predominantly on heat conduction all the way through the different layers of the substrates from a hot point (the base of the component) to a cold point (the furthest surface of the metal base) and, usually, thereafter, through a dissipator.

## Excerpt: 'The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2'

08/02/2022 | Didier Mauve and Robert Art, Ventec
As the second in this two-part series, The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, by Didier Mauve and Robert Art builds on the material presented in the first book by describing up-to-the-minute products and design techniques for thermal management with IMS.