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Computational fluid dynamics software tools can be useful in considering the effect on a printed circuit board of such things as package selection, board layout and structure as well as enclosure design.
This Mentor Graphics white paper explains:
- Approaches to PCB thermal management studies with CFD
- Automating PCB thermal design modifications using Design of Experiments
- Utilizing parametric studies to explore a range of operating scenarios early in the design process
- Example: Heatsink optimization for cPCI card for cost-effective design
- Tradeoffs: Heat sink geometry & mass vs component allowable temperature ranges and layout
Bin Zhou, EDADOC
With the development of communication and IT industries and the ever-increasing demand for information analysis, many chip makers have racked their brains trying to provide customers with better technology, such as increased computing power and storage capacity of chips as well as diversifying their product offerings.
Dr. John Parry, CEng, Mentor
When designing a PCB, thermal issues are often locked in at the point of selecting and laying out the chip package for the board. After that, only remedial actions are possible if the components are running too hot. Assumptions made about the uniformity of the airflow in these early design stages can mean a disaster for the commercial viability of a PCB if those assumptions are incorrect. A different approach is needed to improve reliability and to optimize board performance. Dr. John Parry of Mentor explains.
Andy Shaughnessy, PCB Design007
If you mention thermal management in a group of PCB designers and design engineers, Mike Jouppi’s name usually pops up. Mike is an engineer and founder of the Thermal Management LLC consulting firm. He spent years updating IPC’s charts on current-carrying capacity, which had been unchanged since the 1950s. I recently caught up with Mike and asked him to give us his views on the state of thermal management, as well as the tools and standards related to thermal design.