Reading time ( words)
Gary Carter, senior manager of CAD engineering for Fujitsu Network Communications, discusses the first board fabricated and assembled using IPC-2581B. This 20-layer board features 21,000 component pins and 15,000 holes, with controlled impedance on all layers. He also gave a presentation on IPC-2581B during the Design Forum.
To watch this interview, click here.
Real Time with...IPC
During IPC APEX EXPO 2018, the IPC-2581 Consortium held a demo of this open-source data transfer standard, attracting numerous designers, fabricators and assembly providers. Jim Pierce of Axiom Electronics and Bob Miklosey of Aegis Software sat down to discuss the demo and their involvement with the consortium. Axiom now charges more for designs submitted in the Gerber format.
Hemant Shah and Ed Acheson, Cadence Design Systems
The IPC-2581 format was created in the early 2000s with the merger of two competing formats: ODB++ and GENCAM. The new format, the brainchild of the late Dieter Bergman, languished with no adoption until 2011, when a small group of companies created the IPC-2581 Consortium with the goal of getting this open, neutral and intelligent format adopted. The consortium has been growing steadily in recent years. Its membership now includes more than 100 associate members in addition to its more than 90 corporate members.
Real Time with DesignCon
SiSoft President and CTO Barry Katz sat down with Editor Andy Shaughnessy to share his thoughts on the company's papers presented during DesignCon 2018, as well as SiSoft's latest products and plans for 2018.