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Registration is now open for the Mentor PCB Systems Forum, one day of technical sessions for PCB designers. No matter the software tool you use, the Mentor PCB Systems Forums spans the entire design flow.
Presented in cities around the world, this free event delivers design know-how, tips, and tricks that will help your engineering organization become significantly more productive and efficient regardless of which design tools you currently use. Each forum is free of charge, including lunch and refreshments.
For 2016, Mentor Graphics has expanded the agenda to address the demanding design challenges of the Connected World of mobility and the Internet of Things. This includes multi-board system development, advanced PCB design and manufacturing technologies as well as 3D design with complex form factors.
New this year is the SI/PI track showing how pre- and post-layout signal and power integrity analysis can help optimize product performance, cost, and reliability. IPC representatives will also be on hand, sharing ways to make attendees more competitive as engineers and designers.
The first North American session is scheduled for April 27, 2016 at the Santa Clara Marriott in Santa Clara, California.
To register for a Mentor PCB Systems Forum near you, click here.
Andy Shaughnessy, PCBDesign007
I had the opportunity to talk with our contributor Doug Brooks recently. He has been doing some research on temperature effects on PCB traces over the last few years, and I wanted to check the status of his latest thermal efforts. He discussed his work with Dr. Johannes Adam, why temperature charts based on a trace in isolation are inaccurate, and how the industry remained so wrong about PCB temperatures for so long.
Andy Shaughnessy, PCB Design007
If you mention thermal management in a group of PCB designers and design engineers, Mike Jouppi’s name usually pops up. Mike is an engineer and founder of the Thermal Management LLC consulting firm. He spent years updating IPC’s charts on current-carrying capacity, which had been unchanged since the 1950s. I recently caught up with Mike and asked him to give us his views on the state of thermal management, as well as the tools and standards related to thermal design.
Patty Goldman, I-Connect007
IPC’s fall committee meetings were held in conjunction with SMTA International, as has been the case for several years now. Patty Goldman sat in on some subcommittee meetings, including one on laminates, where she met up with Ventec COO Mark Goodwin for a discussion on thermal management from a laminate supplier’s perspective.