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Registration is now open for the Mentor PCB Systems Forum, one day of technical sessions for PCB designers. No matter the software tool you use, the Mentor PCB Systems Forums spans the entire design flow.
Presented in cities around the world, this free event delivers design know-how, tips, and tricks that will help your engineering organization become significantly more productive and efficient regardless of which design tools you currently use. Each forum is free of charge, including lunch and refreshments.
For 2016, Mentor Graphics has expanded the agenda to address the demanding design challenges of the Connected World of mobility and the Internet of Things. This includes multi-board system development, advanced PCB design and manufacturing technologies as well as 3D design with complex form factors.
New this year is the SI/PI track showing how pre- and post-layout signal and power integrity analysis can help optimize product performance, cost, and reliability. IPC representatives will also be on hand, sharing ways to make attendees more competitive as engineers and designers.
The first North American session is scheduled for April 27, 2016 at the Santa Clara Marriott in Santa Clara, California.
To register for a Mentor PCB Systems Forum near you, click here.
Bob Potock, Zuken
A new generation of 3D multiboard product-level design tools offer major improvements by managing multiboard placement in both 2D and 3D, and enabling co-design of the chip, package and board in a single environment. Multiboard design makes it possible to create and validate a design with any combination of system-on-chips (SOCs), packages, and PCBs as a complete system. Chip-package-board co-design enables designers to optimize routability via pin assignment and I/O placement to minimize layer counts between the package, chip and board. The new design methodology makes it possible to deliver more functional, higher performing and less expensive products to market in less time.
Andy Shaughnessy, I-Connect007
For our multi-board design issue, I interviewed Dave Wiens, product marketing manager for Mentor, a Siemens business. We discussed how the multi-board design technique differs from laying out single boards, along with the planning, simulation and analysis processes required to design multi-board systems.
Chang Fei Yee, Keysight Technologies
This article briefly introduces the 4-level pulse amplitude modulation (PAM-4) and its application in 400 Gigabit Ethernet (400GbE), to support the booming data traffic volume in conjunction with the deployment of 5G mobile communications. Furthermore, this article also highlights the essential pre-layout effort from signal integrity perspective for physical (PHY) link design on a PCB, including material selection, transmission line design and channel simulation to support 56Gbps data rate that paves the way for seamless communication in 400GbE.