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Jack Fisher, technical director for the High-Density Packaging Group, discusses the latest projects that the consortium is focusing on. He explains that member companies have full access to all of the R&D data that is developed. One of the group's most interesting current efforts involves optoelectronics.
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Dan Beaulieu, D.B. Management Group
Over the course of his career, Mark Thompson, CID+, engineering support at Prototron Circuits, has evaluated thousands of data packages and delivered numerous talks to designers and engineers about how to create the perfect package. In the spirit of “garbage in, garbage out,” data packages must be perfect to create quality boards. Learn all this and more in The Printed Circuit Designer’s Guide to… Producing the Perfect Data Package!
Andy Shaughnessy, Design007 Magazine
Artificial intelligence (AI) has been making inroads into a variety of industries in the past decade or so, from automobiles to medical devices. Naturally, EDA tool companies are taking a look at AI. Does AI offer a way forward for PCB design tool developers? I recently interviewed Paul Musto, director of marketing for the Board Systems Division of Mentor. We discussed Mentor’s plans for integrating AI into EDA tools, and why we may be at the very beginning of understanding the pros and cons of this new technology.
Errors and inaccuracies slow the process down because the CAM department has to correct their data package or ask customers to clarify their intent. In the quick-turn prototype business where people pay for time, a slowdown on a three-day turn can be a disaster. I recently sat down with Thompson to find out more about his new book and discuss the quest for the perfect data package.