RTW IPC APEX EXPO: HDP Users Group Update with Jack Fisher


Reading time ( words)

Jack Fisher, technical director for the High-Density Packaging Group, discusses the latest projects that the consortium is focusing on. He explains that member companies have full access to all of the R&D data that is developed. One of the group's most interesting current efforts involves optoelectronics. 

To watch this video, click here.

Share


Suggested Items

Advanced Stackup Planning with Impedance, Delay and Loss Validation

08/02/2018 | Yuriy Shlepnev, Simberian
A typical PCB design usually starts with the material selection and stackup definition—the stackup planning or design exploration stage. How reliable are the data provided by the material vendors and PCB manufacturers? Can we use these data to predict trace width and spacing for the target trace impedance or to calculate delays or evaluate the loss budget?

Paving the Way for 400Gb Ethernet and 5G

06/26/2018 | Chang Fei Yee, Keysight Technologies
This article briefly introduces the 4-level pulse amplitude modulation (PAM-4) and its application in 400 Gigabit Ethernet (400GbE), to support the booming data traffic volume in conjunction with the deployment of 5G mobile communications. Furthermore, this article also highlights the essential pre-layout effort from signal integrity perspective for physical (PHY) link design on a PCB, including material selection, transmission line design and channel simulation to support 56Gbps data rate that paves the way for seamless communication in 400GbE.

Show & Tell: IPC APEX EXPO 2018 is on the Books!

05/14/2018 | Happy Holden
I-Connect007's Happy Holden reviewed the recently concluded IPC APEX EXPO 2018. Among the highlights: Less than 10% of all new orders arrive at the PCB fabricator’s facility with complete, accurate design data. Most have missing or incorrect data.



Copyright © 2018 I-Connect007. All rights reserved.