Cadence Expands OrCAD to Address Flex and Rigid-Flex Challenges


Reading time ( words)

Today at CDNLive EMEA, Cadence Design Systems, Inc. announced the OrCAD 17.2-2016 release with new capabilities for OrCAD Capture, PSpice Designer and PCB Designer that address challenges with flex and rigid-flex design as well as mixed-signal simulation complexities in IoT, wearables and wireless mobile devices. This latest release reduces PCB development time by addressing the need to design reliable circuits for smaller, more compact devices.

This OrCAD portfolio includes technology enabled for integrated rigid-flex planning, design and real-time visualization, as well as built-in translators that enable direct design imports from select EDA vendors. PSpice Designer now supports system-level simulation using C/C++/SystemC and VerilogA, via the new PSpice compact model interface. This enables hardware/software virtual prototyping so that electrical engineers can design and simulate intelligent IoT devices. OrCAD is the only fully scalable PCB design solution available in the market that seamlessly transitions from mainstream to enterprise PCB solution with the Allegro environment. For more information on the latest OrCAD solution, click here

The new Cadence OrCAD solution provides a complete scalable and an integrated solution from schematics to simulation to layout using Capture, PSpice Designer and PCB Designer that address challenges with flex and rigid-flex design as well as mixed-signal simulation complexities in IoT, wearables and wireless mobile devices.

To enable a faster and more efficient flex and rigid-flex design creation critical to IoT, wearables and wireless devices, the OrCAD portfolio uses a new multi-stack-up database capability and extensive in-design inter-layer checks, which helps users avoid errors introduced through manual checking. The OrCAD portfolio also features enhancements targeted towards improving PCB editors' productivity and ease-of-use in padstack editing, constraint management, shape editing and in-design DRCs. To address efficiency needs, the portfolio includes an advanced design differencing engine that enables design review with global teams using state of art visuals. Finally, to give designers more control over their design component annotation process, advanced annotation and auto-referencing capabilities are now available.

"This latest OrCAD release has given us confidence in getting a functional PCB without CAD errors the first time. Prior to this, we were always cautious that our PCB packages would introduce unforeseen errors and we would have to factor one spin of the board that was barely functional," said David Edwards, founder and CEO of Abicom. "Cadence has built tools that are enabling us to develop better designs faster, while giving us a better understanding of expected performance. This advancement has saved us upwards of £3-8K per new board design."

"OrCAD continues to be the clear choice for new and existing companies designing IoT, wearable and mobile products," said Dirk Müller, CEO, FlowCAD EDA-Software Vertriebs GmbH. "The new flex and rigid-flex capabilities allow designers to create faster and smarter products in a timely and cost-effective manner."

"Our customers are demanding solutions that address their broader system-design challenges," saidSteve Durrill, senior product engineering group director, SPB Solutions at Cadence. "The latest OrCAD release provides upfront virtual prototyping support in PSpice, support for high-speed interfaces and a comprehensive implementation solution for rigid/flex designs. We are confident this latest release of the OrCAD solution provides the time to market savings our customers require."

About Cadence

Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. Visit www.cadence.com.

Share


Suggested Items

PCB Cooling Strategies, Part 1

01/17/2018 | Bin Zhou, EDADOC
With the development of communication and IT industries and the ever-increasing demand for information analysis, many chip makers have racked their brains trying to provide customers with better technology, such as increased computing power and storage capacity of chips as well as diversifying their product offerings.

Lee Ritchey On the Future of PCB Design

12/11/2017 | Barry Matties, Publisher, I-Connect007
I spoke with long-time PCB design instructor and Right the First Time author Lee Ritchey during the recent AltiumLive event in Germany. Lee and I discussed everything from the advice he offers to young PCB designers to his thoughts on where the industry is going and what’s missing from today’s electrical engineering curriculum.

Cannonballs, eBooks, and Signal Integrity

12/04/2017 | Andy Shaughnessy and Pete Starkey, I-Connect007
I-Connect007 editors Andy Shaughnessy and Pete Starkey recently met with Polar Instruments Managing Director Martyn Gaudion at productronica. They discussed the success of "The Printed Circuit Designer’s Guide to…Secrets of High-Speed PCBs," the ongoing challenge of facilitating communication between designers and fabricators, and the influence of chemical bond-enhancement processes on insertion loss.



Copyright © 2018 I-Connect007. All rights reserved.