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IPC—The Association Connecting Electronics Industries is seeking technical papers for presentation and professional development courses for IPC APEX EXPO 2017.
Presenting at IPC APEX EXPO provides visibility for you and your organization. Thousands of individuals receive the technical proceedings from this event, ensuring that your material will be seen by key managers and executives from all segments of the worldwide electronics industry.
Submissions are sought on design, materials, assembly, processes and equipment in areas from adhesives and advanced technology to underfills and via plugging.
Next year’s IPC APEX EXPO, with the theme Technology’s Turning Point, will be held from February 12–16 at San Diego Convention Center in California.
For more information, click here.
Stephen Las Marias, I-Connect007
Transition Automation Inc. recently developed a large-area benchtop stencil printer targeted for high-mix low- or medium-volume production. In an interview with I-Connect007, Mark Curtin talks about the new system, and why metal squeegees are the way to go when it comes to solder paste printing.
Russell Poppe, JJS Manufacturing
Much has been written about the increasing shortages of electronic components such as MLCCs, chip resistors and other semiconductor devices. And the manufacturing industry is now seeing price increases and greatly extended lead times. It seems the situation is likely to get rapidly worse rather than better. What can we do? Read on.
Jason Fullerton, Alpha Assembly Solutions
This paper investigates and compares the performance of no-clean liquid wave soldering fluxes using a commercially available localized extraction and cleanliness testing system, and surface insulation resistance (SIR) testing. Find out which test is suitable for your processes.