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IPC—The Association Connecting Electronics Industries is seeking technical papers for presentation and professional development courses for IPC APEX EXPO 2017.
Presenting at IPC APEX EXPO provides visibility for you and your organization. Thousands of individuals receive the technical proceedings from this event, ensuring that your material will be seen by key managers and executives from all segments of the worldwide electronics industry.
Submissions are sought on design, materials, assembly, processes and equipment in areas from adhesives and advanced technology to underfills and via plugging.
Next year’s IPC APEX EXPO, with the theme Technology’s Turning Point, will be held from February 12–16 at San Diego Convention Center in California.
For more information, click here.
Bob Wettermann, BEST Inc.
There are a variety of reasons behind pads getting "lifted" completely or partially from the laminate of a PCB. Per the just revised IPC-A-610 Revision G, a defect for all three classes occurs when the land is lifted up one or more pad thicknesses. Lifted pads can occur when a device has been improperly removed or there is a manufacturing defect in the board construction. In any case, as with any repair, the ultimate decision on the ability to repair the pad lies with the customer.
Stephen Las Marias, I-Connect007
It seems like it wasn't too long ago when I was writing about the optimism of the electronics manufacturing and assembly industry going into 2017. Now, here we are again at the beginning of the new year, looking at new trends, disruptive technologies, and emerging markets for 2018. I am also proud to announce our new branding as well as our fresh, new look.
Every year, we like to take a look back at the most popular SMT news and articles. These are the top 10 most-read SMT articles from the past year.