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This paper, "BER- and COM-Way of Channel-Compliance Evaluation: What Are the Sources of Differences?" won the DesignCon 2016 Best Paper Award. It analyzes the computational procedure specified for Channel Operation Margin (COM) and compares it to traditional statistical eye/BER analysis.
The paper was written by Vladimir Dmitriev-Zdorov, Chuck Ferry, and Christian Filip of Mentor Graphics, and Alfred P. Neves of Wild River Technology. To read this paper, click here.
Successful signal integrity analysis depends on a fundamental concept: impedance. Without a thorough understanding of the impedance values that a signal encounters along the way, designers cannot maintain good signal quality from source to receiver.
Barry Matties, I-Connect007
Tony Tung is a recent graduate from Taiwan who has come up with a new way for PCB designers and makers to create breadboards using printed paper circuits. I caught up with Tony at the recent San Mateo Maker Faire and sat down with him to learn more about this project.
As designs get smaller, power densities at all packaging levels increase dramatically. Removing heat is critical to the operation and long-term reliability of electronics, and component temperatures within specification are the universal criteria used to determine the acceptability of a design. This PADS paper discusses 10 things designers need to know about thermal design.