-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
LPKF Exhibits New Laser Solutions for Innovative Interconnects at ECTC in Las Vegas
May 23, 2016 | LPKF Laser and ElectronicsEstimated reading time: 1 minute
LPKF Laser & Electronics has announced it will exhibit at the 2016 Electronic Components and Technology Congerence (ECTC) which will be held June 1-2, 2016 at The Cosmopolitan in Las Vegas, NV.
LPKF, a leading manufacturer of laser systems for electronics manufacturing, will showcase its new solutions across the semiconductor packaging spectrum in booth 320.
One of the technologies highlighted by LPKF is the efficient via forming in large glass substrates (TGV); a process of creating through holes and blind vias, with defined diameters as small as 15 microns, using single-pulse glass modification through laser beam in combination with subsequent a standard wet etching process. Glass substrates with a thickness of 50 to 500 micron can be processed with this method. Clean-room compatibility and stress-free processing make this innovative laser-based process ideal for thin glass interposers and also for solid glass cores for FCBGA substrates – eliminating chips, burr, micro-cracks or voids.
LPKF has developed the new Vitrion laser system specifically developed for these applications. The system is designed for high volume mass production, capable of forming more than 5,000 homogeneous vias per second.
Another technology represented at the ECTC Conference will be Laser Direct Structuring (LDS-technology) for MEMS applications, a method of creating ultra-fine circuits directly on 3D parts used for chip packaging. The highly flexible and stress-free laser direct structuring process is designed for advanced electronic packaging where space is a premium and high layout-flexibility is much appreciated.
About LPKF
Established in 1976, LPKF Laser & Electronics manufactures milling machines and laser systems used in circuit board and microelectronics fabrication, medical technology, the automotive sector, and the production of solar cells. LPKF’s worldwide headquarters is located in Hannover, Germany and its North American headquarters resides near Portland, Ore.
Suggested Items
IPC Bestows Posthumous Hall of Fame Award to Industry Icon Michael Ford
04/18/2024 | IPCIPC honored the late Michael Ford, Aegis Software, for his extraordinary contributions to the global electronics manufacturing industry with the IPC Raymond E. Pritchard Hall of Fame Award at IPC APEX EXPO 2024. IPC’s most prestigious honor, the Hall of Fame Award is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry. Ford, an industry leader and valued IPC volunteer, died suddenly in January 2024.
SEMI Applauds U.S. Chips Act Award for Samsung Electronics Facilities to Strengthen Domestic Semiconductor Supply Chain
04/17/2024 | SEMISEMI, the industry association serving the global electronics design and manufacturing supply chain, applauded the United States Department of Commerce’s announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support the expansion of Samsung Electronics’ presence in Texas and the company’s development and production of leading-edge chips.
Northrop Grumman honors Calumet Electronics with Supplier Excellence Award
04/17/2024 | Calumet ElectronicsNorthrop Grumman Corporation has recognized Calumet Electronics during the company’s 2024 Supplier Excellence Awards for “exceptional performance and unwavering commitment to delivering with excellence.” Calumet is one of 70 suppliers recognized from across the globe. In its award category of “Supplier Strategic Excellence,” Calumet was honored alongside global corporations such as Amazon Web Services, Dell Technologies, and Eaton Corporation.
Ark Electronics Expands Global Manufacturing Factory Network in North America and Europe
04/17/2024 | PRNewswireElectronic Manufacturing Company Ark Electronics recently announced the expansion of its Global Factory Network with the addition of Electronics Manufacturing Service (EMS) capabilities in Mexico and Europe.
Designing Electronics for High Thermal Loads
04/16/2024 | Akber Roy, Rush PCB Inc.Developing proactive thermal management strategies is important in the early stages of the PCB design cycle to minimize costly redesign iterations. Here, I delve into key aspects of electronic design that hold particular relevance for managing heat in electronic systems. Each of these considerations plays a pivotal role in enhancing the reliability and performance of the overall system.