Reading time ( words)
The Orange County Chapter of the IPC Designers Council will hold a "Lunch 'n' Learn" meeting on Wednesday, June 15 in Irvine, California. Guest speaker Julie Ellis of TTM Technologies will focus on PCB cost-driving factors that should be considered early in the design phase to save your company money.
A designer is faced with many challenges when planning your layout to achieve a balance of performance, quality and reliability versus cost. In this presentation, Julie Ellis of TTM Technologies will discuss the many factors that contribute to cost and explore the trade-off considerations for design optimization.
She will explore panel utilization, layer count, material selection, via structure choices, via-filling options, the impact of various sequential laminations, plating processes, surface finishes, scoring, milling and back drilling. Attendees will learn various rules of thumb to help you make better choices for mitigating the cost of the boards you design.
Reserve a spot on your calendar on Wednesday, June 15 from 11:30 am to 1:30 pm for this educational “Lunch ‘n Learn” meeting event.
Date: Wednesday June 15, 2016
Time: 11:30 am - 1:30 pm
Where: Harvard Athletic Park multi-purpose room, Irvine, California
Please RSVP no later than noon on Tuesday, June 14, 2016
There are two ways to RSVP:
Harvard Athletic Park
14701 Harvard Ave.
Irvine, California 92606
(The multi-purpose room is at the SOUTH end of the athletic fields)
Dave Wiens, Mentor, a Siemens Business
PCB designers working with flex or rigid-flex technology face many potential risks that can derail a project and cause costly design failures. As the name implies, flex and rigid-flex designs comprise a combination of rigid and flexible board technologies made up of multiple layers of flexible circuit substrates, attached internally and/or externally to one or more rigid boards. These combinations provide flexibility for the PCB designer working on dense designs that require a specific form factor. Rigid-flex allows the PCB design team to cost-efficiently apply greater functionality to a smaller volume of space, while providing the mechanical stability required by most applications.
Craig Armenti, Mentor Graphics
While the traditional “design-separately-then-assemble” approach minimized potential issues with the flex portions of the product, it also had several inherent disadvantages. These include the cost associated with the physical connectors; the space required for the physical connectors; the need to properly manage interconnects that have to transition between the separate rigid and flex PCBs (through the connectors); and, of course, the time and cost associated with assembly. The move to the current generation of rigid-flex technology mitigates these issues; however, they are replaced with a different set of challenges and concerns.
The Silicon Valley Chapter of the IPC Designers Council was treated to a delicious barbecue lunch on October 13 at TTM’s San Jose facility. About 20 PCB designers and support professionals gathered for the tri-tip lunch-n-learn conference.