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Please join Zuken on beautiful Hilton Head Island, South Carolina, for Zuken Innovation World Americas 2017. After two fantastic events in San Diego, it was time to experience a new and exciting location. ZIW 2017 is scheduled for April 24-26, 2017.
Zuken University and the Expert Bar were both a big hit with participants in San Diego. ZIW Americas 2017 will have an expanded Zuken University class offering with longer classes. The Expert Bar will be back to provide 1:1 access to our product experts throughout the event. This is also an excellent opportunity to see and learn about the new 2017 product releases. You don’t want to miss it.
For more information, click here.
Andy Shaughnessy, Design007 Magazine
The next generation of PCB designers is coming—slowly, but surely. What will this new group of designers mean for EDA vendors like Cadence Design Systems? Andy Shaughnessy recently interviewed Dan Fernsebner, product marketing group director and a veteran EDA guy, and Bryan LaPointe, lead product engineer and representative of the younger generation. They discussed the next generation of PCB designers, some of the best ways to draw smart young people into this industry, and why the PCB designers of the future may need to have a college degree just to get an interview.
I-Connect007 Editorial Team
Not too long ago, historically speaking, most electronic products contained only one PCB. But multi-board designs have become almost ubiquitous over the past decade, and EDA software companies are working to improve and simplify the multi-board design process. Editors Andy Shaughnessy and Stephen Las Marias spoke with Ben Jordan, director of product and persona marketing for Altium, about the company’s multi-board design tools, the challenges that customers face, and the numerous trade-offs that designers must contend with while performing multi-board design.
Bob Potock, Zuken
A new generation of 3D multiboard product-level design tools offer major improvements by managing multiboard placement in both 2D and 3D, and enabling co-design of the chip, package and board in a single environment. Multiboard design makes it possible to create and validate a design with any combination of system-on-chips (SOCs), packages, and PCBs as a complete system.