FUTURECAR: New Era of Automotive Electronics - New Workshop by SEMI and Georgia Tech


Reading time ( words)

SEMI and Georgia Tech have announced a new program, “FUTURECAR: New Era of Automotive Electronics Workshop” to take place on November 9-10 at Georgia Tech in Atlanta, Georgia. Addressing the fast changing intersection of automobiles and electronics, the workshop offers insight and collaboration on autonomous cars, electric vehicles, enabling high-bandwidth wireless communication, and components that can withstand high temperature and demanding emerging requirements.

Complex and new technical components and architectures are being introduced in automotive electronics ─ including autonomous vehicles for improved safety, sensing electronics, secure high-speed streaming communications and infotainment, and improved batteries for electric cars.  As consumer demand continues to increase, automotive electronics will account for an increasing percentage of the value of the car, creating a multi-billion dollar market within a decade.

Workshop sessions include:  

  • Autonomous driving: Cameras, radar and lidar (light detection and ranging)
  • Electric Cars: Co-design and fabrication of Gallium Nitride (GaN) and System in Chip (SiC) devices and packages for high power
  • Computing and communications: High-bandwidth wireless (5G), digital (2.5D / 3D) and photonic Si and glass technologies
  • High-temperature and high-reliability: substrates, components, interconnections, encapsulants and reliability mechanisms
  • Cross supply-chain collaborative platforms to assess technology options and business risks
  • Complete value-chain enablement and development of standards and roadmaps

The workshop will focus on what is needed in technologies, and technology ecosystem stewardship, to enable swift and cost-efficient commercialization. The FUTURECAR workshop draws on the synergy between Georgia Tech in R&D along with its industrial partners, and SEMI in global electronics manufacturing stewardship across the supply-chain. Key to the depth of the program is support from co-sponsors International Electronics Manufacturing Initiative (iNEMI) in roadmaps, and International Electrical and Electronics Engineers Components, Packaging and Manufacturing Technology (IEEE CPMT) and International Microelectronics Assembly and Packaging (IMAPS) as global electronics societies.

Workshop co-chairs are Rao Tummala, Georgia Tech; Pushkar Apte, SEMI; Bill Bader, iNEMI; and Urmi Ray, Qualcomm and IMAPS.

Visit the FUTURECAR event page here for more details.

About SEMI

SEMI® connects more than 2,000 member companies and more than a quarter-million professionals worldwide to advance the science and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped our members grow more profitably, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C.

Share

Print


Suggested Items

Today’s MilAero Options: Outsourcing—‘Everybody’s Doing it’ Not so True Today

06/27/2016 | Marc Carter
There was a time, not so many decades ago, when that most commonly-stated mantra (“lower labor costs”) behind offshoring printed circuit fab (and some assembly) operations, still had some case-by-case validity.

New Tools for Human-Machine Collaborative Design

04/25/2016 | DARPA
Advanced materials are increasingly embodying counterintuitive properties, such as extreme strength and super lightness, while additive manufacturing and other new technologies are vastly improving the ability to fashion these novel materials into shapes that would previously have been extremely costly or even impossible to create.

Inkjet-printed Liquid Metal Could Bring Wearable Tech, Soft Robotics

04/08/2015 | Purdue University
New research shows how inkjet-printing technology can be used to mass-produce electronic circuits made of liquid-metal alloys for "soft robots" and flexible electronics.



Copyright © 2020 I-Connect007. All rights reserved.