Mentor Video: Impact of Power Integrity on Temperature


Reading time ( words)

One of the most common outputs from a DC Drop simulation is a current density plot.  But how much is too much current density?  The answer depends on temperature rise, and requires a PI-thermal co-simulation to properly characterize. 

HyperLynx PI does an iterative co-simulation to include the effects of current density on temperature rise, and the effect of temperature on current density and voltage drop, to quickly pinpoint problems in your PCB's power distribution network. This new video explains how designers can keep their PDS from feeling the heat.

To view this video, click here.

hyperlynx_screenshot.png

Share

Print


Suggested Items

IPC High-reliability Forum and Microvia Summit Review, Part II

08/06/2019 | Pete Starkey, I-Connect007
The Microvia Summit on May 16 was a special feature of the 2019 event in Baltimore, since microvia challenges and reliability issues have become of great concern to the PCB manufacturing industry. It provided updates on the work of members of the IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee and opportunities to learn about latest developments in methods to reveal and explain the presence of latent defects, identify causes and cures, and be able to consistently and confidently supply reliable products.

Sensible Design: Protecting PCBs from Harsh, Challenging Environments

07/03/2018 | Alistair Little, Electrolube
Think very carefully about the sort of environment your PCB is likely to encounter. It is easy to over-engineer a product so that it will survive the very worst of conditions, but worst conditions may only be fleeting or transient. Therefore, a resin solution with a lower temperature performance specification will often cope. Take temperature extremes, for example. Your application may experience occasional temperature spikes of up to 180°C, which you might feel deserves treatment with a special resin.

Streamlining Thermal Design of PCBs

01/10/2018 | Dr. John Parry, CEng, Mentor
When designing a PCB, thermal issues are often locked in at the point of selecting and laying out the chip package for the board. After that, only remedial actions are possible if the components are running too hot. Assumptions made about the uniformity of the airflow in these early design stages can mean a disaster for the commercial viability of a PCB if those assumptions are incorrect. A different approach is needed to improve reliability and to optimize board performance. Dr. John Parry of Mentor explains.



Copyright © 2019 I-Connect007. All rights reserved.