The internet of things connects an ever-growing number of smart devices for up-to-the-minute monitoring and tracking of many common events. Head out to most parts of the open ocean, however, and no such capability exists for real-time monitoring of maritime activity.
The solder paste printing process has always been considered a major contributor to yield loss. According to many studies, solder paste printing accounts for up to 70% of all PCB assembly defects. For the December issue of SMT Magazine, we interviewed experts in the solder paste printing process to learn more about the key issues leading to this huge percentage of defects, and the technology developments that are addressing these challenges and improving yields in the process.