The Printed Circuit Designer's Guide to... Flex and Rigid-Flex Fundamentals
This concise and highly useful book on flexible circuits from ASC was written to provide circuit designers, both new and seasoned, with valuable and important information that will help to assure their first pass success in getting their products to market.
The Printed Circuit Designer's Guide to... Design for Manufacturing (DFM)
This eBook has something to offer for the seasoned designer and the newbie. After reading this eBook, PCB designers will have all the DFM knowledge they need to eliminate costly design re-spins and get a good board back, every time.
Flexible Circuit Technology, 4th Edition provides the basic knowledge required to design, manufacture and use flexible circuits while avoiding many of the potential problems that may be encountered by those who attempt to learn from their own experiences. Previous editions of the book have proved a valuable resource for those new to the technology and have served as a quick reference for those with a working knowledge of flexible circuits and their applications.
The widespread use of new electronic components employing Ball-Grid Array (BGA), Chip Scale Packaging (CSP), and other evolving technology form-factors means new fabrication techniques must be used to create printed circuit boards (PCBs) that will accommodate parts with extremely tight lead pitches and small geometries.
PCB designers and design engineers currently see getting a design right the first time as a foreign concept. The trial-and-error design method has been the rule, not the exception, since the advent of transistor-transistor logic (TTL). Chapter 1 looks at rules of thumb, design rules, and the recent movement to get PCB designs right the first time.
In the global economy that is today’s business environment, there are no guarantees. In this environment, the big continue to get bigger through acquisition or elimination of the competition. Never before has US manufacturing had to look over our shoulder as we do now.
Reflow soldering of through hole components can simplify the entire assembly process for companies running tin/lead or lead-free and continue to maintain the quality and reliability of the products being built. The reflow-only process can also eliminate the cost and waste associated with wave and selective soldering. By eliminating two processes, floor space and energy costs can be reduced--a definite advantage to the end user.