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After a crazy year like this, we shouldn’t be surprised that this trade show season is unlike any other. Here’s one of the many “silver linings” of 2020: We actually dodged a bullet earlier this year when COVID-19 hit after most of our industry’s big events had taken place. In this week’s top five, we have an assortment of trade show and conference news items, plus a few examples of technological trends and innovation.
The best technology is dead in the water if your domestic supply chain won’t support it. That was just one of the takeaways from Dr. Judy Dickson’s talk during the SMTA Additive Electronics TechXchange. In her presentation, titled “Advanced PWBs: A Collaboration Between Design, Operations, and the Supply Chain,” Dickson, a senior principal systems engineer at Northrop Grumman Mission Systems, laid out the many challenges her department faces in fielding HDI advanced packaging into the next decade. Most of these challenges are related to sourcing the necessary materials in the U.S.
Traditional supplier qualification processes have been forced to rapidly change to new approaches as suppliers have been affected by shelter-in-place directives across the globe. Alfred Macha discusses the fundamentals of assessment...
In past columns, Sagi Reuven has written about topics mostly related to the shop floor. In this column, he talks about design for manufacturing (DFM). It is clear to everyone in the Industry 4.0 era that the holy grail is to close the...
If you have read any of Bill Cardoso's previous columns, you know that he is passionate about X-rays, cars, and electronics. In this column series, he talks about some of his idols, including Curie, Roentgen, Marconi, Galvin, and...
