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MIL-AERO Weekly Newsletter

  7/27/2010 Current Mil/Aero News: MilAero007 | Mil/Aero Events | Subscribe to Our Newsletters

 
  This Week's Feature
  


Top Story
  • The Next Stage of Assembly: 3-D and Solder-Free

    • Solder-free and 3-D assembly will help bridge the performance and density gaps needed to extend Moore's Law, as lithography on silicon runs out of steam. It will offer America the chance to restore her electronic manufacturing mojo and provide for her security. Please, America, don't miss this chance to leap-frog the rest of the world!

    		 
     

    Top Story
     
    Feature

  • IPC Military Conference Highlights EMS Opportunities

    • The conference will offer essential, up-to-date information from noted experts to help EMS companies understand what the military needs from them, the important steps they need to take to comply with government restrictions and how to obtain proper certifications to become an in-demand supplier.

     
     Military and Aerospace Electronics News

     

     


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