Welcome to I-007eBooks. Below you’ll find our comprehensive library of books written by industry experts on a variety of important topics. Peer-reviewed by topic specialists, I-007eBooks are the gold standard for technical education in the circuit board industry. Download your favorite title(s) free!
"With this book, Bob Neves provides an important update to our understanding of via testing by articulating the distinction between their reliability and robustness."
Review from Mike Carano, Consultant, Global Electronics Association
"Sustainability and reliability go hand in hand in printed circuit board fabrication."
Review from William E. Webb, Technical Director, Aster Technologies
"Even experienced test professionals will gain valuable insights and fresh perspectives from his expertise.."
Review from Stanton Rak, PhD, SF Rak Company
"This book contributes useful clarity to an area of growing importance in high-reliability electronics manufacturing."
Review from Gary Korkala
"The Printed Circuit Assembler's Guide to... X-ray Inspection is a must read for those engaged in the radiographic inspection of electronic components. It provides a clear, concise description of the X-ray process and includes a comprehensive number of comparative images."
Review from Eric Bogatin
"If you are new to designing circuit boards for 10 Gbps and above systems, or touch any part of the PCB supply chain, get a jump up the learning curve from the experience offered in this book from a respected industry expert."
Review from Dana Korf, Principal Consultant, Korf Consultancy LLC
"This book covers essential design considerations to ensure PCB manufacturability. These features impact the overall PCB quality, reliability, and cost-effectiveness. Good practical size and tolerance guidelines are also provided for the designer to meet specifications while yielding the lowest cost. I recommend this for new designers, especially before formal training. Additionally, it’s suitable for school students as part of their science curriculum."
Review from Richard Coyle, Consulting Member of Technical Staff, Nokia Bell Labs
"Readers will find this book provides technical insights into the ever-evolving challenges of the assembly and reliability of low-temperature solder alloys. This second volume includes updates on fourth-generation low-temperature solders and a preview of the capabilities of ultra-low temperature (ULT) solders."
Review from Jason Sciberras, President, Saline Lectronics Division of Emerald Technologies
"I would recommend that any data-driven engineers focused on taking their manufacturing operations to the next level read this book."
Review from Dr. Helmut Schweigart, Head of Reliablility & Surfaces, Zestron Europe.
"Readers will learn the advantages and disadvantages of different encapsulation materials and the importance of the application process. In order to find the right balance between benefit and effort, the author suggests using analytical approaches to configure the process and its settings. Additionally, she is always conscious of the need for sustainability when it comes to electronic assemblies."
Review from John R. Watson, Legrand North America
"At a time when electronics are not just taking small steps but rather large leaps forward, this is an appropriate book for anyone working with PCB design. With countless and ever-changing steps involved in every design, it presents a clear understanding of the process. This book will be the go-to reference for all of our designers at Legrand North America."
Review from Gus Becerra, Principal Manufacturing Engineer, Marvell
"As fabrication and manufacturing technologies advance, it is necessary to evolve our methods to analyze and review designs. This book utilizes data-driven concepts in all aspects of the fabrication and assembly processes to improve design capabilities.
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Review from Christopher St. Mars, Process Engineer, Intervala
"This book offers an accurate look at the aspects and challenges the electronics manufacturing industry faces with regards to SMT Inspection and its surrounding technology. In-depth insight on new and exciting true 3D inspection technology is provided, with a look into the future of leveraging big data management and autonomous manufacturing for a smarter factory."
Review from Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH
"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification.
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Review from Steve Williams
"There is something here for everyone. I highly recommend downloading this book right away!"
Review from Bob Tise, R&D Engineer, EMP Shield
"PCB design is as much art as science. While reading this book will not, itself, make you a professional PCB designer, it will help you make better decisions and trade-offs, saving time and money."
Review from Lambert Schutters, General Manager,
ESCATEC Penang
"We need the right tools to create the best design for the intended purpose. This book is a great introduction and guide on how to approach the process holistically."
Review from Kyle Burk, PhD, President and Director of Engineering for KBJ Engineering, LLC
"This textbook is a great addition and supplement to the first edition. It delves deeper into the science of insulated metal substrates and their useful, often overlooked, properties for proper thermal management."
Review from Eric Bogatin
"I’ve been involved in aspects of PCB manufacturing and design for almost 40 years, and even I picked up a few useful nuggets of knowledge from this book."
Review from Mark Thompson, Engineering Manager, Out of the Box
"I love this book. Particularly the sections on the effects of the glass weave, the history of laminate, and the difference between Dk and Effective Dk. I highly recommend this book for any designer or engineer looking to better understand laminate!"
Review from Joe O'Neil, Principal, OAA Ventures
"The Printed Circuit Assembler’s Guide to Solder Defects is an outstanding summary of the how’s and why’s of paste theory, defect causation and recommended best practices. This short read contains real world advice from the experts. I highly recommend it for anyone involved in the PCB Assembly process."
Review from Lee Ritchey, Founder and President, Speeding Edge
"Author Brad Griffin offers readers a very good explanation of system-level analysis of complex and high-speed electronic designs. I highly recommend this book for those who are getting started with the design of PCBs and systems that are used in data centers."
Review from Happy Holden, Consulting Technical Editor, I-Connect007
"This book provides good education, with examples and explanations to help the reader understand how the smart factory can improve performance and competitiveness."
Review from Dan Beaulieu, President, DB Management Group
"For those who are, shall we say, 'less technical' than others, it’s refreshing—not to mention face-saving, at times—to be able to understand terms like insulated metal-clad PCBs (IMPCBs), metal-clad PCBs (MCPCBs) and mixed-technology PCBs."
Review from Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH
"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification.
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Review from Farid Anani, VP of Operations, Computrol Inc.
"This book is a must-read for those embarking on their IIoT journey; it provides a very accurate description of preparation requirements and risks to consider and avoid, not just technologically, but also organizationally."
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Review from Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison
"This book explains how information embedded in a PCB design layout database can be leveraged to efficiently and dynamically output more accurate PCB design documentation."
Review from Alex Stepinski, vice president, GreenSource Fabrication
"Happy takes a textbook-style approach using easy-to-follow language. He provides step-by-step points for the DIYer, especially for making your own chemistry controllers, while providing examples from his past experiences.
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Review from Douglas Brooks, retired engineer, Ph.D.
"Mark does an outstanding job detailing what needs to be included in the handoff between the board designer and fabricator. Understanding and following his advice will lead to a smooth transition between these two functions. His new book should be required reading for every designer.
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Review from Raiyo Aspandiar, Ph.D., Senior Engineer, Intel Corporation
"This book does a good job of distilling out the chaff and focusing on the most relevant, valuable information available, including main drivers for the current worldwide interest in low-temperature soldering, the history of solder paste alloys and flux developments, as well as various applications for these materials."
Review from Andy Shaughnessy, Managing Editor, Design007 Magazine
"This book will help the reader gain a comprehensive understanding of the physical realities of insulated metal substrates and their applications in the thermal management of electronic assemblies."
Review from Mark Thompson, customer technical liaison at Prototron Circuits
"From someone who has been on the board fabrication side for over 30 years attempting to explain all these things to customers, I can say this book is a 'must-have' for anyone who wants to make sure they get their product to perform the way they want it to."
Review from Eric Bogatin
"The Printed Circuit Designer’s Guide to… Power Integrity by Example from Mentor, A Siemens Business, explores the specific problem of via-to-via coupling through a cavity starting from the ground floor."
Review from Eric Bogatin
"If you care about signal integrity, you are sure to pick up a few nuggets of insight from this new eBook."
Review from Happy Holden
"Martyn Gaudion of Polar has taken the extremely complex topic of signal integrity and provided an easy to understand explanation of this phenomena. I encourage everyone to download and read this engaging e-book."
Review from Andy Shaughnessy
"This book has everything you need to know about solderless assembly process, which could be the most innovative—and disruptive—technological development in our industry’s history."
Review from Alex Ippich
"A nice summary of many of the issues that engineers have to work through, without overly complicated formulas and details."
Review from Dan Beaulieu
"This book is long overdue. Finally, a book on AS9100 certification written in clear and concise language.""