TUC Gains IPC-4101E Validation Services QPL CertificationJuly 28, 2017 | TUC
Estimated reading time: 1 minute
George Hsin, Chief Strategy Officer of Taiwan Union Technology Corporation (TUC), is pleased to announce that TUC has gained certification to IPC-4101E validation services for three more products. TU-933, TU-933D and TU-933E are now listed on the IPC website under QPL Specification Sheet 102 in addition to TU-933+ which was the first product so listed. To earn the QPL, TUC successfully completed an intensive audit based on IPC's foremost standard on base materials for laminates and prepregs: IPC 4101 Specification for Base Materials for Rigid and Multilayer Printed Boards and passed the qualification tests at Microtek Laboratories China, an IPC Validation Services approved independent test lab.
Specification Sheet 102 outlines performance requirements for copper-clad laminates and prepregs comprised of modified polyphenylene ether using brominated constituents to provide a UL-94 V-0 flame rating. The Tg must be greater than 185 degrees C.
As a Specification Sheet 102 QPL product, TUC’s ThunderClad 3 is an advanced material designed for high speed computing, telecommunications, radio frequency super low loss field applications. ThunderClad 3’s electrical performance is competitive with PTFE-based, hydrocarbon-based very low loss materials, but capable for high layer count circuit board design with excellent thermal reliability. ThunderClad 3 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, CAF resistance, and are also compatible with modified FR-4 processes.
For these IPC-4101E/102 certified four products, TUC met or exceeded IPC's Validation Services QPL requirements for producing materials used by printed circuit board manufacturers in the electronics industry. Thus, the company is now listed as an IPC trusted source capable of manufacturing in accordance with industry best practices. TUC and other trusted sources of suppliers can be found on IPC's QML/QPL (Qualified Product Listing) database.
TUC is a leading global developer and manufacturer of prepregs and laminates for the electronics industry. We work relentlessly to provide materials that deliver solutions for present and future designs by partnering with our customers, as well as market-leading OEMs. With this partnership, we are able to offer outstanding value with unparalleled service and support.
TUC is committed to innovation and leading technologies while maintaining product manufacturability. Our products deliver excellent resistance to moisture and chemicals as well as industry-leading anti-CAF and CTE properties. We provide superior global technical resources and a competitive edge to equip customers with solutions that generate extraordinary value. Please visit the TUC website for more information.
There has always been pressure to reduce line and space as we have seen the bleeding edge technology go from 8 mils to 5 mils and then to 3 mils. The difference between “then” and “now” is that the prior advancements, for the most part, used the same processes, chemistry and equipment going from 8 mils to 3 mils. But going from 3 mil to sub 1 mil trace and space is a quantum leap in printed circuit board (PCB) technology that requires a whole new set of processes and materials.
In a previous column, the critical process of desmear and its necessity to ensure a clean copper surface connection was presented. Now, my discussion will focus on obtaining a void-free and tightly adherent copper plating deposit on these surfaces. After the desmear process, the task is to insure a continuous, conductive, and void-free deposit on the via walls and capture pad. Today, there are several processes that can be utilized to render vias conductive.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
MKS’ Atotech, a leading surface finishing brand of MKS Instruments, will participate in the upcoming IPCA Expo at Bangalore International Exhibition Centre (BIEC) and showcase its latest PCB manufacturing solutions from September 13 – 15.
Flexible circuit applications can be as basic as furnishing electrical interconnect between two conventional circuit board assemblies, or to prove a platform for placing and interconnecting electronic components. During the planning and pre-design phase of the flexible circuit, there will be several material and process related questions that need to be addressed. Most flexible circuit fabricators welcome the opportunity to discuss their customers’ flexible circuit objectives prior to beginning the actual design process.