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In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
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EIPC SpeedNews: News from the European PCB Industry
August 7, 2017 | EIPCEstimated reading time: Less than a minute
- Call for Papers for EIPC Winter Conference Lyon, France, February 1–2, 2018
- SMT Hybrid Packaging 2018: Call for Tutorials Launched
- Schweizer Electronic AG: Preliminary Figures for the First Half Year 2017 and Adjustment of Forecast
- IoT Growth Slower than Expected
- Made in China 2025: Make or Break for Europe?
- Forthcoming SMART Dates for 2017
- IMAPS News for July 2017.... Holiday Time is Coming!
- The "RELPACK" Reliability Conference
- Ventec's Martin Cotton Joins Speaker Line-up at Advancements in Thermal Management Conference 2017
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Altus Group Helps BitBox Unlock Productivity and Efficiency Gains with New Reflow Oven
04/22/2024 | Altus GroupAltus Group, a leading provider of capital equipment, has recently assisted BitBox, a UK-based electronics design, engineering and manufacturing company in upgrading its operations with the implementation of a new reflow oven from Heller Industries.
IDTechEx Examines the Opportunities for Wearables in Digital Health
04/19/2024 | IDTechExIDTechEx’s report, “Digital Health and Artificial Intelligence 2024-2034: Trends, Opportunities, and Outlook”, covers this ongoing trend in the consumer health wearables market and includes analysis of the opportunities and roadmap for biometric monitoring.
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Cicor Shareholders Approve All Proposals
04/19/2024 | Cicor Technologies Ltd.At the Annual General Meeting of Cicor Technologies Ltd. in Zurich, the shareholders approved all proposals.