I-Connect007 Editor’s Choice: Five Must-Reads for the Week


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It’s a new year, and time for new resolutions and new beginnings. “New year, new you” certainly is reflected in this past week’s news. We saw several announcements regarding mergers, acquisitions, and organizational changes, plus some government legislation to help kick off the new year. Based on viewing activity, readers were keen to keep up on the changes under way. 

 

Arcline Investment Management Acquires Ohmega Technologies 
Published January 7

Ohmega Technologies becomes a member of a technology platform group of companies recently acquired by Arcline Investment Management. I-Connect007 will have further coverage of this news forthcoming. 

CTS Acquires Temperature Sensors Company 
Published January 1

From the press release, “QTI, doing business as QTI Sensing Solutions, is a leading designer and manufacturer of high-quality temperature sensors serving original equipment manufacturers (OEMs) with mission-critical applications in the industrial, aerospace, defense and medical markets. QTI’s sensors are used to measure temperature in gas, liquid or solid mass depending on the application to ensure equipment performance and reliability.” 

Naprotek Purchased by Edgewater Capital Partners 
Published January 7

Earlier this week, Naprotek also announced a new vice president of operations, Andrew Dalisa, and the appointment of Daniel Radler as Director of Engineering. It’s already been a busy year organizationally at Naprotek. 

Whiteside’s View From the Summit: An Industry Perspective 
Published January 4

Nolan Johnson spoke with Shane Whiteside to get his unique perspective on the industry as president and CEO of Summit Interconnect, as well as his position on the board of directors for the IPC. Whiteside discusses the business challenges he sees overall. 

IPC Praises U.S. Government Actions to Bolster Security and Resiliency of Defense Electronics Supply Chain 
Published January 4

This statement by Chris Mitchell, vice president of global government relations at IPC, the global electronics manufacturing association, comments on recent actions by the U.S. government to bolster the security and resiliency of the U.S. defense electronics supply chain.

 

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RBP Discusses New Management and Plans for the Future

11/23/2021 | Nolan Johnson, I-Connect007
Ernie Litynski, president of RBP Chemical Technology and Dan Carey, incoming executive vice president, brief Nolan Johnson on the recent organizational changes that brought Carey on board. Both Litynski and Carey outline how they see these changes benefiting their customers and partners, including in the defense and aerospace sectors. As they explain, it's their expertise at helping solve problems that customers value most.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/26/2021 | Andy Shaughnessy, Design007 Magazine
This week, we have a round-up of stories from around the industry, including a Real Time with… IPC APEX EXPO interview with Ventec, an article by Tamara Jovanovic about eliminating “garbage in, garbage out,” a review of an EIPC webinar by Pete Starkey, and news about another trade show going virtual this summer. And last but certainly not least, we bring you our one-minute video salute to all the fantastic people in this industry who we’ve worked with for decades. Enjoy!

Bonding Hybrid Multilayer Constructions at Rogers Corporation

03/10/2021 | Real Time with...IPC
John Ekis, Rogers Corporation's market segment director for aerospace and defense, discusses the SpeedWave family of low-dielectric constant, ultra-low-loss prepreg materials with excellent filling and bonding characteristics for hybrid multilayer constructions. SpeedWave prepreg is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing. SpeedWave is available in multiple spread and open weave glass style and resin content combinations, and is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing.



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