Samsung Develops Industry’s First High Bandwidth Memory with AI Processing Power
February 17, 2021 | Business WireEstimated reading time: 1 minute
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed the industry's first High Bandwidth Memory (HBM) integrated with artificial intelligence (AI) processing power — the HBM-PIM. The new processing-in-memory (PIM) architecture brings powerful AI computing capabilities inside high-performance memory, to accelerate large-scale processing in data centers, high performance computing (HPC) systems and AI-enabled mobile applications.
Kwangil Park, senior vice president of Memory Product Planning at Samsung Electronics stated, "Our groundbreaking HBM-PIM is the industry's first programmable PIM solution tailored for diverse AI-driven workloads such as HPC, training and inference. We plan to build upon this breakthrough by further collaborating with AI solution providers for even more advanced PIM-powered applications."
Rick Stevens, Argonne’s Associate Laboratory Director for Computing, Environment and Life Sciences commented, “I’m delighted to see that Samsung is addressing the memory bandwidth/power challenges for HPC and AI computing. HBM-PIM design has demonstrated impressive performance and power gains on important classes of AI applications, so we look forward to working together to evaluate its performance on additional problems of interest to Argonne National Laboratory.”
Most of today's computing systems are based on the von Neumann architecture, which uses separate processor and memory units to carry out millions of intricate data processing tasks. This sequential processing approach requires data to constantly move back and forth, resulting in a system-slowing bottleneck especially when handling ever-increasing volumes of data.
Instead, the HBM-PIM brings processing power directly to where the data is stored by placing a DRAM-optimized AI engine inside each memory bank — a storage sub-unit — enabling parallel processing and minimizing data movement. When applied to Samsung's existing HBM2 Aquabolt solution, the new architecture is able to deliver over twice the system performance while reducing energy consumption by more than 70%. The HBM-PIM also does not require any hardware or software changes, allowing faster integration into existing systems.
Samsung’s paper on the HBM-PIM has been selected for presentation at the renowned International Solid-State Circuits Virtual Conference (ISSCC) held through Feb. 22. Samsung’s HBM-PIM is now being tested inside AI accelerators by leading AI solution partners, with all validations expected to be completed within the first half of this year.
Suggested Items
Ansys, NVIDIA Pioneer Next Era of Computer-Aided Engineering
03/29/2024 | ANSYSAnsys announced a collaboration with NVIDIA to develop next-generation simulation solutions powered by accelerated computing and generative AI.
Cogiscan Collaborates with Koh Young to Unveil How Factory Insights Software Transforms Data Into Action at IPC APEX EXPO
03/28/2024 | Koh YoungKoh Young, the industry leader in True3D measurement-based inspection solutions, is excited to announce Factory Insights, the latest offering from Cogiscan, will be demonstrated alongside KSMART in Koh Young booth 2112 during IPC APEX Expo.
ASMPT to Exhibit Smart Manufacturing at IPC APEX EXPO 2024
03/27/2024 | ASMPTWith its innovative, data-driven Intelligent Factory concept and a comprehensive hardware and software portfolio around SMT production, market and innovation leader ASMPT will be a major presence at the IPC APEX EXPO 2024, the industry’s main event in California.
Semtech Pioneers the Path to 6G with Advanced 5G Wireless Technologies
03/27/2024 | BUSINESS WIRESemtech Corporation, a leader in high-performance semiconductors, IoT systems and cloud connectivity services, unveiled its latest innovations poised to shape the future of 5G and pave the way for 6G.
IDC: Half of Asia’s Top Firms to Embrace AI-Driven Headless BI and Analytics by 2026
03/27/2024 | IDCA recent IDC FutureScape report, IDC FutureScape: Worldwide Data and Analytics 2024 Predictions — Asia/Pacific (Excluding Japan) Implications, highlights that by 2026, 50% of Asia/Pacific-based Top 2000 organizations (A2000) will adopt AI-driven headless BI and analytics with chat, Q&A, and proactive notification functionality, quadrupling the number of users with access to contextual information.