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As part of I-Connect007’s coverage of the IPC APEX EXPO 2021, four premium sponsors shared their knowledge and expertise. Each company is well-known and respected for the work it is doing to advance and maintain a high standard in the industry. The premium sponsors—Taiyo America, Burkle North America, Super Dry, and Blackfox—each share five important things you need to know about their sector of the industry.
I-Connect007 has a mission as an industry leader to create and share content that is both practical and thought-provoking. We hope you enjoy these features, and stay tuned for I-Connect007’s extensive coverage of the IPC APEX EXPO, March 8-12.
To access the Top Five Things You Need to Know, please click on the links below:
Taiyo America: Solder Masks
Burkle North America: Direct Imaging
Super Dry: Moisture Management
Blackfox: Manufacturing Training
“The Top Five Things You Need to Know” are short, informative tips that will bring clarity and efficiency to your organization.
Nolan Johnson, I-Connect007
VJ Electronix's Brennan Caissie shares the benefits of a new inspection tool that can be used on a variety of boards, with an automated system that takes the pressure off the manufacturing floor operators and can provide feedback all the way to the design process.
Barry Matties, I-Connect007
Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.
Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. Bev Christian is a facilitator for the High Density Packaging User Group (HDPUG) and an adjunct associate professor in the Department of Mechanical and Mechatronics Engineering of the University of Waterloo, Waterloo, Ontario, Canada. In the past 31 years he has held positions at Nortel, BlackBerry, and CALCE; all in the areas of materials and failure analysis. Bev has never missed an IPC APEX EXPO since its inception. He is a member of 27 IPC committees and attends as time and the lack of clones allow.