Spirit AeroSystems Europe Delivers First Set of A320 Family RTM Spoilers
August 31, 2021 | Spirit AeroSystems, Inc.Estimated reading time: 1 minute
Spirit AeroSystems (Europe) Limited (UK), a subsidiary of Spirit AeroSystems Holdings, Inc., has successfully delivered the first set of new advanced composite spoilers to Airbus for the A320 Family. The spoilers are produced using Spirit’s pioneering Resin Transfer Moulding (RTM) technology and are the first to feature on a flying aircraft.
The redesigned spoiler is produced using a highly-automated advanced manufacturing, out-of-autoclave process, resulting in significantly improved manufacturing efficiencies, and reduced energy and costs compared to the original, more traditional design. Spirit is the first to industrialize this innovative composite technology in the UK aerospace sector.
Scott McLarty, SVP Airbus Programs said: “This exciting milestone is another example of Spirit’s leadership in the development of innovative wing technologies and manufacturing processes to meet our customers’ needs. We remain committed to investing in the new technologies and processes required to deliver a more sustainable aerospace industry and help meet the UK’s net zero goals.”
The spoilers are produced in Spirit’s world-class manufacturing facility in Prestwick, Scotland, using the latest automation and robotics, which included investment from the Scottish Government in the development of the technology. Such cost-effective technologies and manufacturing processes will play a central role in the development of the next generation of aircraft programs, and help Spirit increase its competitive advantage in advanced manufacturing.
Suggested Items
Northrop Grumman honors Calumet Electronics with Supplier Excellence Award
04/17/2024 | Calumet ElectronicsNorthrop Grumman Corporation has recognized Calumet Electronics during the company’s 2024 Supplier Excellence Awards for “exceptional performance and unwavering commitment to delivering with excellence.” Calumet is one of 70 suppliers recognized from across the globe. In its award category of “Supplier Strategic Excellence,” Calumet was honored alongside global corporations such as Amazon Web Services, Dell Technologies, and Eaton Corporation.
Ansys Joins BAE Systems’ Mission Advantage Program to Advance Digital Engineering Across US Department of Defense
04/16/2024 | ANSYSAnsys announced it is working with BAE Systems, Inc., to accelerate the adoption of digital engineering and MBSE across the Department of Defense (DoD).
IMAPS & IPC to Host Onshoring Workshop
04/16/2024 | IPCThe International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host an Onshoring Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.
Lockheed Martin Boosts Domestic Microelectronics Capabilities for Pentagon Aerial Defense Program
04/08/2024 | Lockheed MartinLockheed Martin will work with Intel Corporation, and Altera, an Intel Company, to support the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) program for the Office of the Under Secretary of Defense for Research and Engineering (OUSD R&E).
Northrop Grumman’s Integrated Battle Command System Demonstrates Another Successful LTAMDS and Patriot Live-Fire Integration
04/08/2024 | Northrop GrummanNorthrop Grumman Corporation’s Integrated Battle Command System (IBCS) seamlessly fused data from a Lower Tier Air and Missile Defense Sensor (LTAMDS) to acquire, track, engage and intercept a long-range cruise missile surrogate with a PAC-3 Missile Segment Enhancement during a recent test event held at White Sands Missile Range in New Mexico.