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Finally! A Book About PCB StackupsFebruary 21, 2022 | I-Connect007 Editorial Team
Estimated reading time: Less than a minute
In this book, brought to readers by Siemens Digital Industries Software and I-007eBooks, author and stackups expert Bill Hargin discusses materials, laminate datasheets, impedance planning, and more. This book provides the reader with a broader understanding of stackup planning and material selection in an effort to comprehend what Hargin calls “the design within the design.”
Signal integrity expert and professor Eric Bogatin says, “I’ve been in involved in aspects of PCB manufacturing and design for almost 40 years, and even I picked up a few useful nuggets of knowledge from this book.”
Nokia Principal Engineer Joe Smetana agrees: “This is an excellent primer for people who are doing high-speed PCB design. It connects the dots between signal integrity and manufacturing.”
Hundreds of eager readers have already downloaded this book. Get your free copy today at I-007ebooks.com. We hope you enjoy The Printed Circuit Designer’s Guide to Stackups: The Design within the Design.
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Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.
I have been in and around circuit boards most of my life. I started 20 years ago in my family’s PCB shop, leaving after a couple of years to start my own software company. About a year ago, I returned to the family business, and the first thing I noticed was that nothing had really changed. We were doing the same things in the same way as the day I left. After talking to several experts in the industry, I realized it was worse than that: The manufacturing of PCBs had not changed in 70 years.