I-Connect007 Editor’s Choice: Five Must-Reads for the WeekJuly 15, 2022 | Andy Shaughnessy, Design007 Magazine
Estimated reading time: 3 minutes
I’m getting a lot of out-of-office replies. Are you all on the beach now? It’s 91 degrees every day here in Atlanta lately, but each afternoon it rains like we’re in a horror movie, and that drops the temperature down to the subtropical arena. Still, I’ll take heat over freezing any day.
Things are heating up in our industry too, as we see from my top five choices this week. First-quarter electronic design revenue is up year-on-year, but PCB revenue barely moved the needle YOY. Editor Nolan Johnson spent the week at SEMICON West and the FLEX Conference, and he brings us a review of these conferences, co-located at the Moscone Center in San Francisco. As he notes, printed electronic circuits are beginning to gain a foothold in the market.
Cadence Design Systems has invested in data center design, and IPC is lobbying Congress to help strengthen our supply chain. Finally, we have some “common sense” from Dan Beaulieu. In this column, he discusses companies that try to be all things to all customers, taking on projects far outside their “sweet spot.”
FLEX Conference 2022: If You Build It, We Will Buy It
Published July 13
Our colleague Nolan Johnson has been covering the FLEX Conference and SEMICON West in San Francisco this week, and visiting manufacturers as well. As he points out in this article, much of the FLEX Conference focused on printed electronic circuits. PEC have been making big advances lately, often behind the scenes. This is a segment to watch, as OEMs drive most of the innovation here—not the fabricators.
The supply chain has been in a jam for a while now. Remember how lead times were getting long pre-COVID? IPC has been pushing Washington to take action, and it seems that politicians may be starting to listen. That’s one silver lining to the whole supply chain problem: Washington is finally becoming aware of the critical role that U.S. electronics manufacturers play in our economy, as well as our ability to equip our warfighters. Check it out.
Data centers are front and center now. Over the past few years, we’ve pointed out the importance of data and—more importantly—data management. Cadence Design Systems has acquired Future Facilities, a company that creates software for data center design. The company’s software utilizes 3D digital twins and augments Cadence’s Celsius Thermal Solver. You can expect other EDA companies to invest in data center technology in the near future.
It’s kind of a mixed bag here. Electronic design revenue in Q1 is up 12.1% year-on-year, but PCB is a laggard here, clocking in at only 1.4%. Semiconductor IP is the engine pulling that particular train. And last year we were digging out from the pandemic, so I wouldn’t worry too much about PCB at this point. I bet your company is having a pretty good year. Am I right?
It's Only Common Sense: Big Macs and PCBs—Do What You Do Well
Published July 11
I’ve never understood why some companies try to please everyone. It’s just not possible. I get it; you want to keep revenue coming in. But some PCB manufacturers take on jobs that are far outside their core competency, just to keep the lights on. Dan Beaulieu sticks a fork in this turkey of an idea. As Dan says, do what you do well.
This week’s must-reads cover a little bit of everything: advanced packaging substrates, rigid-flex design, the potential loss of tribal knowledge, ultra HDI processing, and the need for fabricators to begin utilizing Smart systems. In a few weeks, we’ll be attending SMTA International in Minneapolis, and then productronica in Munich. We hope to see you on the road!
Siemens, TSMC Collaborate to Help Mutual Customers Optimize Designs Using Foundry's Newest Advancements09/29/2023 | Siemens
Siemens Digital Industries Software announced new certifications and collaborations with longtime partner TSMC, resulting in the successful qualification of multiple industry-leading Siemens EDA product lines for the foundry’s latest process technologies.
Cadence Design Systems, Inc. announced the availability of new system prototyping flows based on the Cadence® Integrity™ 3D-IC Platform that support the 3Dblox 2.0 standard.
TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance at the TSMC 2023 OIP Ecosystem Forum.
Keysight Technologies, Inc., Synopsys, Inc., and Ansys announced a new reference flow for the TSMC N4PRF, the world's leading semiconductor foundry's advanced 4 nanometer (nm) radio frequency (RF) FinFET process technology.