Elbit Systems Awarded $76M Contract to Supply Electronic Warfare Training Capability
September 19, 2022 | Elbit SystemsEstimated reading time: Less than a minute
Under the contract, Elbit Systems will supply the Asia-Pacific Air Force with a cutting-edge solution enabling aircrews to conduct airborne training in a real life, multi-threat EW arena. The solution integrates a range of transmitters, sensors, communications, command and control as well as analytical and debriefing tools.
Oren Sabag, General Manager of Elbit Systems ISTAR & EW, commented: “EW readiness has become critical to mission effectiveness and survivability, driving increasing demand for EW training capabilities beyond the existing synthetic ones. By integrating our advanced EW technologies and the Company’s unique training and simulation capabilities we can supply a solution that improves readiness and reduces costs.”
Suggested Items
Camtek Receives Approx. $25M from Tier-1 Manufacturer for High Bandwidth Memory (HBM)
03/29/2024 | CamtekCamtek Ltd. announced that it has received a new order for approximately $25 million from a tier-1 HBM manufacturer, for the inspection and metrology of High Bandwidth Memory (HBM). Most of the systems are expected to be delivered in the second half of 2024.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
CentraTEQ to Showcase Wide Range of Vibration & Environmental Test Systems at Battery Tech Expo 24
03/26/2024 | CentraTEQEnvironmental and vibration test specialists CentraTEQ are excited to be exhibiting at the upcoming Battery Tech Expo, scheduled to take place at Silverstone on April 25, 2024.
SEMI 3D & Systems Summit To Spotlight Trends In Hybrid Bonding, Chiplet Design And Environmental Sustainability
03/26/2024 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 12-14 June, 2024,
iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs
03/25/2024 | IPCToday’s system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors. As a result, electronics manufacturing has to deliver increasingly complex integration of diverse technologies with system designs that blur the distinction between chip, package, board, and assembly.