MKS’ Atotech to Participate in CPCA ShowMarch 20, 2023 | Atotech
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MKS Instruments announced its participation in the upcoming CPCA Show 2023, the international electronic circuits exhibition in Shanghai, China held from March 22-24, 2023. MKS will be present with representatives from two of its strategic brands, Atotech and ESI, and present its latest products and manufacturing solution for printed circuit board and package substrate manufacturing.
Product experts from overseas will be joining the local team and be available to discuss the latest industry trends and challenges, as well as introduce the new combined product offering consisting of PCB production equipment (wet-to-wet process equipment, laser systems, and auxiliaries), chemistry, software, and service. The company will be exhibiting at booth 7T26 and this year’s product highlights include:
- V-Plate: The new gold standard for vertical conveyor plating equipment for next-generation HDI PCB and package substrates
- InPro SAP6: The new high-end electrolyte for vertical processing of next-generation package substrates
- New Uniplate: The industry-leading horizontal plating tool for next-generation HDI PCBs and package substrates manufacturing
- Printoganth MV TP2: Next-generation electroless copper for fine-line SAP applications
- BondFilm EX: New bonding enhancement solution for low signal loss high-frequency applications
- PallaBond: Direct pure EPAG for high-end circuitry and reliability application
- CapstoneTM: Flex PCB UV drilling tool for high-performance breakthrough productivity
- GeodeTM: HDI PCB and package substrate high-precision CO2 via drilling tool
There has always been pressure to reduce line and space as we have seen the bleeding edge technology go from 8 mils to 5 mils and then to 3 mils. The difference between “then” and “now” is that the prior advancements, for the most part, used the same processes, chemistry and equipment going from 8 mils to 3 mils. But going from 3 mil to sub 1 mil trace and space is a quantum leap in printed circuit board (PCB) technology that requires a whole new set of processes and materials.
In a previous column, the critical process of desmear and its necessity to ensure a clean copper surface connection was presented. Now, my discussion will focus on obtaining a void-free and tightly adherent copper plating deposit on these surfaces. After the desmear process, the task is to insure a continuous, conductive, and void-free deposit on the via walls and capture pad. Today, there are several processes that can be utilized to render vias conductive.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
MKS’ Atotech, a leading surface finishing brand of MKS Instruments, will participate in the upcoming IPCA Expo at Bangalore International Exhibition Centre (BIEC) and showcase its latest PCB manufacturing solutions from September 13 – 15.
Flexible circuit applications can be as basic as furnishing electrical interconnect between two conventional circuit board assemblies, or to prove a platform for placing and interconnecting electronic components. During the planning and pre-design phase of the flexible circuit, there will be several material and process related questions that need to be addressed. Most flexible circuit fabricators welcome the opportunity to discuss their customers’ flexible circuit objectives prior to beginning the actual design process.