The New Chapter: The Pros and Cons of Tribal Knowledge
Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 4
The Chemical Connection: Don’t Just Blame the EtcherAutomation in Probe Testing Provides Throughput Benefits
April 2, 2015 | Real Time with...IPCEstimated reading time: Less than a minute
The general migration from grid to prober for bare board testing continues, and even high-volume users now see the benefits of automation. Klaus Koziol explains how package testing is driving prober development.
Watch the interview here.
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