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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

09/29/2023 | Andy Shaughnessy, I-Connect007
This week’s must-reads cover a little bit of everything: advanced packaging substrates, rigid-flex design, the potential loss of tribal knowledge, ultra HDI processing, and the need for fabricators to begin utilizing Smart systems. In a few weeks, we’ll be attending SMTA International in Minneapolis, and then productronica in Munich. We hope to see you on the road!

Siemens, TSMC Collaborate to Help Mutual Customers Optimize Designs Using Foundry's Newest Advancements

09/29/2023 | Siemens
Siemens Digital Industries Software announced new certifications and collaborations with longtime partner TSMC, resulting in the successful qualification of multiple industry-leading Siemens EDA product lines for the foundry’s latest process technologies.

Cadence Expands Support for 3Dblox 2.0 Standard with New System Prototyping Flows

09/29/2023 | Cadence Design Systems, Inc.
Cadence Design Systems, Inc. announced the availability of new system prototyping flows based on the Cadence® Integrity™ 3D-IC Platform that support the 3Dblox 2.0 standard.

TSMC Announces Breakthrough Set to Redefine the Future of 3D IC

09/28/2023 | TSMC
TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance at the TSMC 2023 OIP Ecosystem Forum.

Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design for TSMC

09/28/2023 | Keysight Technologies, Inc.
Keysight Technologies, Inc., Synopsys, Inc., and Ansys announced a new reference flow for the TSMC N4PRF, the world's leading semiconductor foundry's advanced 4 nanometer (nm) radio frequency (RF) FinFET process technology.
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