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Rigid-flex: Designing in 3D
In this month’s issue, our expert contributors share their best tips, tricks and techniques for designing rigid-flex circuits. If you’re a rigid board designer considering moving into the 3D world of rigid-flex, this issue is just what the doctor ordered!
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Getting today’s designs “right the first time” is critical, especially with costly advanced PCBs. Simulation and analysis software tools can help you in the fight to eliminate respins. They’re not magical, but they can predict the future of your design.
Advanced, Complex & Emerging Designs
This month, our contributors focus on designing PCBs with advanced, complex and emerging technologies. We investigate design strategies for boards that are on the cutting edge of technology, or crazily complex, or so new that designers are still writing the rules as they go.
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The Readers Speak: Tips on Accelerating your Design CycleOctober 28, 2015 | Andy Shaughnessy, PCBDesign007
Estimated reading time: 1 minute
This month, in addition to publishing feature articles by well-known experts in the field, we decided to collect feedback from the readers—PCB designers and engineers working in the trenches each day. We asked our readers to provide their favorite tips, tricks, and techniques for speeding up the PCB design cycle. Here are 10 tips for cutting your design time, courtesy of designers just like you.
PCB group leader, Slovenia
“Bang on the electrical engineers to squeeze out of them all constraint upfront before starting a design, so that you can put them into rules in the design tool, and then hold them accountable for changes. The rest is easy, in comparison.”
CID+, San Diego
“Know the system the PCB integrates into.”
President of ConnectPCB, Chicago
“Use both hands (i.e., one hand on the mouse, other using shortcut keys or function keys). Type without looking at your hands (they should know where the keys are).”
PCB designer, Aalborg, Denmark
“Learn the limitations of the PCB fabrication process and set up your PCB CAD system accordingly.”
Felipe Lopez Rendon
Packaging design engineer with Intel, Guadalajara, Mexico
“Keep the DRC on most of the time.”
To read this entire article, which appeared in the October 2015 issue of The PCB Design Magazine, click here.
This week’s must-reads cover a little bit of everything: advanced packaging substrates, rigid-flex design, the potential loss of tribal knowledge, ultra HDI processing, and the need for fabricators to begin utilizing Smart systems. In a few weeks, we’ll be attending SMTA International in Minneapolis, and then productronica in Munich. We hope to see you on the road!
Siemens, TSMC Collaborate to Help Mutual Customers Optimize Designs Using Foundry's Newest Advancements09/29/2023 | Siemens
Siemens Digital Industries Software announced new certifications and collaborations with longtime partner TSMC, resulting in the successful qualification of multiple industry-leading Siemens EDA product lines for the foundry’s latest process technologies.
Cadence Design Systems, Inc. announced the availability of new system prototyping flows based on the Cadence® Integrity™ 3D-IC Platform that support the 3Dblox 2.0 standard.
TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance at the TSMC 2023 OIP Ecosystem Forum.
Keysight Technologies, Inc., Synopsys, Inc., and Ansys announced a new reference flow for the TSMC N4PRF, the world's leading semiconductor foundry's advanced 4 nanometer (nm) radio frequency (RF) FinFET process technology.