Pro-Tech Expands Scope of Military Qualification MIL-PRF-31032March 21, 2016 | Pro-Tech Interconnect Solutions
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Pro-Tech Interconnect Solutions has announced that the company has expanded the scope of its key military certification, MIL-PRF-31032/MIL-PRF-55110. The newest capabilities are the result of ongoing capital investment in leading edge technology as well as continuous advancements to our quality management and production capabilities. Several increased capabilities of note include maximum number of layers to 16, minimum mechanical hole size of .0059", aspect ratio of 15:1, and 5 mil laser vias with 1:1 ratio utilizing full via fill copper.
About Pro-Tech Interconnect Solutions, LLC.
Pro-Tech is a Minnesota-based premier manufacturer of high-reliability printed circuit boards for the military, aerospace, medical, industrial, homeland security and avionics industries focusing on prototype to medium volumes including HDI quick turn and heavy copper demands. Pro-Tech’s current certifications include ISO 9001:2008, AS9100C, ISO 13485:2003, MIL-PRF-31032 along with ITAR registration.
There has always been pressure to reduce line and space as we have seen the bleeding edge technology go from 8 mils to 5 mils and then to 3 mils. The difference between “then” and “now” is that the prior advancements, for the most part, used the same processes, chemistry and equipment going from 8 mils to 3 mils. But going from 3 mil to sub 1 mil trace and space is a quantum leap in printed circuit board (PCB) technology that requires a whole new set of processes and materials.
In a previous column, the critical process of desmear and its necessity to ensure a clean copper surface connection was presented. Now, my discussion will focus on obtaining a void-free and tightly adherent copper plating deposit on these surfaces. After the desmear process, the task is to insure a continuous, conductive, and void-free deposit on the via walls and capture pad. Today, there are several processes that can be utilized to render vias conductive.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
MKS’ Atotech, a leading surface finishing brand of MKS Instruments, will participate in the upcoming IPCA Expo at Bangalore International Exhibition Centre (BIEC) and showcase its latest PCB manufacturing solutions from September 13 – 15.
Flexible circuit applications can be as basic as furnishing electrical interconnect between two conventional circuit board assemblies, or to prove a platform for placing and interconnecting electronic components. During the planning and pre-design phase of the flexible circuit, there will be several material and process related questions that need to be addressed. Most flexible circuit fabricators welcome the opportunity to discuss their customers’ flexible circuit objectives prior to beginning the actual design process.