-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
AT&S Tech Days in Santa Clara - Update of the Latest Trends in PCB Technologies
September 1, 2016 | AT&SEstimated reading time: 1 minute
AT&S Americas, LLC is organizing the AT&S Tech Days on September 12-13 in Santa Clara, California. During the first day technical seminars and presentations from AT&S and partners will highlight the latest innovations and market trends for PCB technology. The event will take place at the Santa Clara convention centre. On the second day AT&S offers individualized company forums with its experts at the Santa Clara Hyatt Regency Hotel.
Hosted by Scott Clifford, President AT&S Americas LLC, the presentations will start with an overview of the technology drivers impacting the next generation ofPCB technology. Hannes Voraberger, Group Manager AT&S R&D will describe how PCB and substrate technologies will merge providing continued miniaturization. This technology oriented presentation will be followed by an industry outlook analyzing the key market trends driving interconnect technology, given by Prismark Partners, an electronics industry consulting firm. A customer perspectiveexplaining the 3D system supply chain integration will be presented by the UTAC Group.
Other speakers will address the design for embedded technology with focus on thinner formats and higher integration as well as mobile design considerations like performance, density, cycle time and material.
In addition, PCB flex & rigid technologies and applications, power electronics and thermal management options, mechanical integration and 3D technologies, high-speed and high-frequency in PCB manufacturing are being addressed by the experts.
The complete agenda is available HERE.
Visitors can register HERE.
About AT&S
AT&S is the European market leader and one of the globally leading manufacturers of high-value printed circuit boards. AT&S industrialises leading-edge technologies for its core business segments Mobile Devices, Automotive, Industrial, Medical and Advanced Packaging. In 2016, AT&S will produce two new, leading-edge technologies at the new site in Chongqing (China) – IC substrates and substrate-like printed circuit boards for high-end applications. As an international growth enterprise, AT&S has a global presence, with production facilities in Austria (Leoben and Fehring) and plants in India (Nanjangud), China (Shanghai, Chongqing) and Korea (Ansan, near Seoul). The company employed an average of 8,688 people as of December 31, 2015.
Suggested Items
Absolute EMS Champions Collaboration Between Humans and Robots in Modern Manufacturing
04/19/2024 | Absolute EMS, Inc.Absolute EMS, Inc., an award-winning EMS provider of turnkey contract manufacturing services, offers a perfect factory environment that seamlessly blends robotic automation with human expertise.
Microsoft, Google Join as Sponsors for First-Ever AI Expo for National Competitiveness
04/19/2024 | SCSPThe Special Competitive Studies Project (SCSP), a non-partisan, non-profit project dedicated to strengthening America’s long-term competitiveness in artificial intelligence (AI), announced today two additional sponsors of the AI Expo for National Competitiveness.
IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
04/18/2024 | PRNewswireSemiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations
Intel Brings AI-Platform Innovation to Life at the Olympic Games
04/18/2024 | BUSINESS WIREIntel announced its plans for the Olympic and Paralympic Games Paris 2024. Bringing AI Everywhere, Intel will implement artificial intelligence technology powered by Intel processors on the world’s biggest stage.
Adura Solutions Exhibits at Del Mar 2024
04/18/2024 | Adura SolutionsSumit Tomar, CEO of Adura Solutions, has announced that his company will be exhibiting at this year's Del Mar Electronics and Manufacturing Show to be held at the Del Mar Fairgrounds, San Diego, California, April 24-25.