SEMI Launches Industry 4.0 Readiness Assessment Model to Advance Semiconductor Smart Manufacturing Maturity
November 2, 2023 | SEMIEstimated reading time: 1 minute
SEMI announced availability of the new Industry 4.0 Readiness Assessment Model (IRAM) to help organizations across the semiconductor supply chain assess and track their smart manufacturing technology deployment progress and develop a roadmap for their digital transformations. Created through a collaboration of the SEMI Smart Manufacturing Initiative and industry experts, IRAM aids companies in identifying technology enhancements critical to scaling and sustaining their Industry 4.0 transformation to improve chipmaking efficiency, productivity, and quality.
“The new SEMI IRAM will help semiconductor companies assess their Industry 4.0 compliance as they implement smart manufacturing practices that demand greater connectivity inside chip fabs and throughout the supply chain,” said Ajit Manocha, SEMI President and CEO. “Crucially, the service will also facilitate cybersecurity decision-making as semiconductor companies work with their supply chain partners to protect data traversing Industry 4.0 networks.”
IRAM is designed to support critical operations in fabs and back-end or enterprise-level facilities but also extends to supporting industries and most batch-based manufacturing lines, offering a benchmarking tool to compare Industry 4.0 deployment among peers or across industries. IRAM enables organizations to assess their Industry 4.0 maturity and take the necessary steps to maximize ROI.
“The IRAM model is specific enough for immediate utility and flexible enough for everything from individual operations to entire fabs or the enterprise,” said Andrew Seward, Field Solutions and Marketing and Analytics Manager at Tokyo Electron America, Inc. and co-chair of the SEMI Smart Manufacturing Guidelines Sub-committee. “The model will facilitate the identification of gaps and defining next steps, whether you're just beginning your smart manufacturing journey or are already well on your way.”
Suggested Items
Lockheed Martin Australia, The Department Of Defence Sign Strategic Partnership Head Contract
04/26/2024 | Lockheed MartinLockheed Martin Australia signed a landmark AUD$500 million contract with the Department of Defence to build Australia’s future Joint Air Battle Management System under project - AIR6500 Phase 1 (AIR6500-1).
SMC Korea 2024 to Highlight Semiconductor Materials Trends and Innovations on Industry’s Path to $1 Trillion
04/24/2024 | SEMIWith Korea a major consumer of semiconductor materials and advanced materials a key driver of innovation on the industry’s path to $1 trillion, industry leaders and experts will gather at SMC (Strategic Materials Conference) Korea 2024 on May 29 at the Suwon Convention Center in Gyeonggi-do, South Korea to provide insights into the latest materials developments and trends. Registration is open.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Real Time with... IPC APEX EXPO 2024: Going Vertical: SCHMID's Advanced Solutions for Printed Circuit Boards
04/24/2024 | Real Time with...IPC APEX EXPOEditor Marcy LaRont chats with Bob Ferguson, the president of SCHMID, about advanced solutions for PCBs and the equipment they are highlighting at this year's show. He delves into vertical no-touch handling systems and the prospect of achieving sub-10-micron lines. Inspired by SCHMID's technology, Bob expresses excitement about where the industry is today.
Big Win for Defense Production Act Budget Allocation in FY24 Budget
04/23/2024 | I-Connect007 Editorial TeamOne year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.