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The Chemical Connection: The Practice of Doing Business in Foreign Lands
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GlobalFoundries Joins World Economic Forum’s Global Lighthouse Network for Manufacturing Excellence
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Worldwide GenAI Smartphone End-User Spending to Total $298 Billion by the End of 2025
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GlobalLogic, Ericsson Deploy Private 5G Network at Hitachi Rail’s State-of-the-Art Digital Factory
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Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
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Cadence Expands Digital Twin Platform Library with NVIDIA DGX SuperPOD Model
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I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
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Valens Semiconductor, Samsung Partner to Enhance the MIPI A-PHY Standard Ecosystem
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Smartwatches Drive Micro LED Adoption, Market to Surpass $461 Million by 2029
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STMicroelectronics Sets 20-year Availability for Popular Automotive Microcontrollers
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Qualcomm, Google Cloud Deepen Collaboration to Bring Agentic AI Experiences to the Auto Industry
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Synopsys, GlobalFoundries Establish Pilot Program to Bring Chip Design and Manufacturing to University Classrooms
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Orchard Robotics Raises $22M to Build the AI Farmer and Secure America’s Food Supply
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iPhone 17 Series Shipments to Edge Up in 2025, with 'Air' Model Driving Product Line Shake-Up
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TSMC and South Korean Rivals Lose U.S. Fast-Track Export Privileges for China
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New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
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Pusan National University Scientists Develop Self-Deploying Material for Next-Gen Robotics
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Oceaneering Announces $180 Million of Subsea Robotics Contracts with Petrobras
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Gartner Says AI PCs Will Represent 31% of Worldwide PC Market by the End of 2025
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CG Semi Unveils One of India’s First End-to-End OSAT Facilities in Sanand, Gujarat
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Amkor Technology Issues Statement Regarding City of Peoria Land Acquisition
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Cadence Completes Acquisition of Arm Artisan Foundation IP Business
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Ferric Launches New Integrated Voltage Regulator for AI and High-Performance Processors
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HPE Accelerates Self-driving Network Operations with New Mist Agentic AI-native Innovations
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TI Semiconductors Enable Advanced Earth-observation Capabilities of ISRO’s First-of-its-kind NISAR Mission
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Entegris Announces Plans for $700 Million Investment in the United States, Technology Center in Illinois
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MSU Leveraging Intel 16 and the Cadence Tool Flow for Academic Chip Tapeout
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Liquid Cooling to Scale in AI Data Centers, Penetration to Surpass 30% in 2025
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Infineon Successfully Completes Acquisition of Marvell's Automotive Ethernet Business
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Nordson Electronics Solutions to Exhibit High-yield Fluid Dispensing Technologies for Panel-level and Wafer-level Packaging at SEMICON Taiwan 2025
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U.S. Departments of Commerce, Labor, Education Unveil Workforce Development Strategy to Fuel ‘Golden Age’ of the American Economy
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Cadence Accelerates Development of Billion-Gate AI Designs with Innovative Power Analysis Technology Built on NVIDIA
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U.S. Uses Secret Trackers to Trace AI Chips Diverted to China, Sources Say
08/18/2025 | I-Connect007 Editorial Team
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