-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Improve Board Level Reliability by Reducing Solder Joint Voiding Below 10%
November 13, 2023 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, a leader in integrated materials and technologies for the electronics industry, launches ALPHA® OM-362, its latest next-generation low-void solder paste.
ALPHA OM-362, next-generation ultra-low voiding solder paste
This lead-free, zero-halogen, no-clean paste can deliver less than 10% voiding on Bottom Termination Components (BTCs). The design characteristics of BTCs create void removal challenges during the soldering process, which can lead to ineffective thermal dissipation and mechanical strength in post-reflow applications. Low-voiding solder pastes are an important material in improving board level reliability by reducing this effect.
ALPHA OM-362 complies with the IPC Class III for voiding on BGA components.
Product flexibility
Designed for use with high-reliability ALPHA® Innolot solder and traditional SAC alloys, ALPHA OM-362 provides unmatched low voiding levels and increases process stability as well as thermal and electrical performance, even in the most demanding component applications.
BloombergNEF forecasts over 70% technology adoption for automotive safety electronic components by 2028. To deliver vital solder joint reliability in this use case, low-void solder pastes play a critical role. As well as this application, ALPHA OM-362 is recommended for improving board reliability in aerospace, consumer electronics, industrial, and LED lighting components.
With continuing miniaturization in electronic components for automotive, consumer, and industrial applications, ALPHA OM-362 will deliver on your low-voiding requirements.
Don’t just take our word for it. Reach out to us at www.macdermidalpha.com/contact-us and start your low-void solder paste conversation today.
Suggested Items
epoxySet Unveils UC-2210M - Urethane for Electronic Component Protection
04/29/2024 | epoxySetepoxySet introduces a new and unique, urethane potting compound. The UC-2210M was formulated to protect electronic components in high moisture and thermal environments including constant atmospheric exposure, oceanographic environments and high humidity conditions.
Peters’ ELPEGUARD SL 1800 FLZ Now Also Certified for Outdoor Applications
04/29/2024 | PetersThe conformal coating ELPEGUARD® SL 1800 FLZ from Peters has been awarded an extended UL certificate. The UL 746 E rating certifies that the acrylate-based coating for printed circuit boards, besides featuring the highest non-flammability rating UL V-0, is also suitable for outdoor use.
epoxySet Introduces EO-20E – Versatile, Electrically Conductive Epoxy
04/29/2024 | epoxySetepoxySet produces EPOXIOHM EO-20E an industry established, reliable electrically conductive epoxy designed for solder replacement, chip bonding and other intricate electronic and optoelectronic assemblies. This creamy paste has a an easy to use 1:1 mix ratio with a 48 hour work time.
SCHWEIZER Confirms Group Figures and Outlook for 2024
04/29/2024 | SCHWEIZERSCHWEIZER announces the publication of the annual report for 2023 and confirms the preliminary figures. The SCHWEIZER-Group (according to IFRS) generated sales of EUR 139.4 million in 2023 (previous year: EUR 131.0 million).
Arlon Electronic Materials Awarded Requalification to IPC-4101 QPL for All Polyimide Specification Sheets
04/29/2024 | IPCIPC's Validation Services Program has awarded Arlon Electronic Materials Division, an electronics material manufacturing company headquartered in Rancho Cucamonga, Calif., an IPC-4101 Qualified Products Listing (QPL) requalification for the third time.